Revealing the High Strength and High Thermal Stability of a Nano-Lamellar Cu-0.1 At. % Zr Alloy

Yao Jiang,Saiyang Li,Ningning Liang,Si Lan,Yue Zhang,Wen Yin,Gang Sha,Sergiy Divinski,Gerhard Wilde,Jing Tao Wang
DOI: https://doi.org/10.1016/j.actamat.2024.120163
IF: 9.4
2024-01-01
Acta Materialia
Abstract:Nano-lamellar structured Cu-0.1 at.% Zr alloys are prepared by the combination of equal channel angular pressing and subsequent cryogenic rolling. The advanced processing route enables a systematic reduction of the lamellae boundary spacing down to 45 nm and a concurrent increase of yield strength up to 626 MPa. Subsequent annealing at temperatures up to 673 K induced recovery processes and uniform coarsening through triple junction motion, avoiding a catastrophic degradation of the microstructure and performance and preserving the yield strength at a level comparable to ultrafine-grained copper. Simultaneously, the tensile uniform elongation experienced a substantial recovery up to 11.9 %. The high thermal stability is mainly attributed to the low mobility of grain boundary and the relaxation of non-equilibrium grain boundaries, both of which are facilitated by the microalloying of Cu with Zr. Based on the theory of dislocation pile-up at boundaries, the Hall-Petch equation is adopted and extended to the lamellar structured Cu-0.1 at.% Zr alloy, revealing a lower-critical bound of 90 nm for lamellae boundary spacing, corresponding to an effective boundary spacing of about 150 nm.
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