Silicon-Based Waveguide Integrated Optical Phased Array Chips for LiDAR:Design Challenges and Breakthroughs(Invited)
Xu Weihan,Zhou Linjie,Chen Jianping
DOI: https://doi.org/10.3788/aos241072
2024-01-01
Acta Optica Sinica
Abstract:Significance Light detection and ranging (LiDAR) measures the distances to detectable targets using time-of-flight depth sensing. When coupled with laser beam scanners or arranged in paired emitter-receiver arrays on focal planes, LiDAR systems capture surroundings to create precise 3-D point-cloud representations of the scene. A static point cloud can create a digital twin of physical objects for preservation, inspection, or modeling purposes, which are widely used in fields like surveying, mapping, archaeology, and biological detection. Meanwhile, real-time point clouds, integrated with data from other sensors, dynamically identify and track various targets, which, in turn, facilitates interactive navigation in complex or dynamic environments. A key reason for the proliferation of LiDAR is its capability to offer camera-like resolution due to its near-infrared operating wavelength. LiDAR boasts three to five orders of magnitude of spatial resolution improvement compared to radar. Additionally, driven by the boom in autonomous driving, unmanned autonomous vehicles, and AI-enabled smart robotics, the LiDAR community has been endeavoring to reduce sensor footprint, power consumption, and manufacturing complexity. This effort subsequently lowers adoption costs and integration difficulties with the host platform. Nevertheless, current development primarily relies on miniaturizing discrete components such as lasers, photodetectors, optics, and beam scanners. As an active sensor that integrates power-hungry lasers and trans-impedance amplifiers, ensuring power integrity and managing thermal issues becomes challenging during denser integration. Moreover, it is crucial to achieve high-precision active optical alignment for assembling these discrete components. However, this process often leads to limited throughput, increased costs, and potential robustness issues in real-world applications. Lastly, as LiDAR performance improves in terms of resolution and frame rate, processing the dense pointcloud data becomes computationally intensive, which can bring about data fusion conflicts with other sensors. To address these issues, researchers have been exploring the potential of reinventing LiDAR using photonic integration platforms. Taking advantage of the maturing integration of planar light-wave circuits (PLCs) through semiconductor processes, chipscale solid-state LiDAR offers diffraction-limited integration density, on-chip light manipulation with nano-watts power consumption at gigahertz refresh rates, digitally controlled addressability within the given field-of-view, close or even monolithic integration with electronic circuits, and potentially low cost with high throughput. Among these emerging PLC solutions, LiDAR chips in the form of optical phased arrays (OPAs) directly manipulate the synthesized laser phase front, providing features such as high-speed and seamless solid-state beam scanning and the ability to rapidly change beam direction within a large field of view. This capability enables adaptive scanning based on input cues from other sensors or recognition results from previous frames, allowing denser point clouds to be assigned to high-priority targets for improved real-time accuracy. In essence, OPA-based LiDARs can lock onto high-value targets and track multiple targets similar to their radio counterpart, the active electronically scanned array (AESA), thereby reducing the burden on communication bandwidth and processing power. Furthermore, optical phased arrays eliminate the need for discrete optical components, which not only facilitates manufacturing but also improves the robustness of the sensor. Therefore, an OPA-based LiDAR emits and receives light directly from a flat optical aperture without bulky lenses or mirrors, which helps to reduce the form factor and expand the available field of view. Over the last 15 years, a large number of OPAs have been developed and demonstrated, driven by a strong focus on realizing OPA-based solid-state LiDAR. In this paper, we aim to outline the key challenges and breakthroughs encountered during this development. Principle and Progress A notable distinction between an OPA and an AESA lies in the integration density constraint of dielectric waveguides for OPAs, making it challenging to achieve the half-wavelength condition typical in AESAs. Evaluating the beamforming principle as depicted in Eq. (1) allows for the analysis of periodicity and the formation of grating lobes illustrated in Fig. 1. Advanced beamforming techniques, such as spatial filtering using the element factor, non-periodic array element arrangements, and applying amplitude taper across the array, are explained from a digital signal processing perspective and visually presented in Fig. 2. Subsequently, beam steering principles and behaviors are derived and simulated in Eq. (3) and Fig. 3, respectively. After introducing the beamforming and beamsteering characteristics of OPAs, we establish a relationship between design parameters and device performance. We then calculate the necessary design parameters against typical automotive LiDAR specifications outlined in Table 1, highlighting challenges like highdensity integration of photonic components, exemplified in Fig. 4. The requirement for a vast number of components further complicates the system, leading to losses and a field-of-view limited by aliasing. Breakthroughs in complexity reduction have been achieved through wavelength-tuning-assisted beam-steering, as illustrated in Fig. 5, with recent advancements in the architecture of two-dimensional dispersive arrays detailed in Table 2. Specifically, we emphasize the need for narrow-linewidth lasers capable of wide-range wavelength tuning and introduce our external cavity laser, depicted in Fig. 6. To mitigate insertion loss and boost beamforming efficiency, on-chip gain can be implemented via heterogeneous integration of III/V amplifiers on the silicon platform. The wafer-bonding process flow, pioneered by the University of California, Santa Barbara (UCSB) and Interuniversity Microelectronics Center (IMEC), is illustrated in Fig. 7. Additionally, recent demonstrations of heterogeneous-integrated OPA LiDAR by Samsung are introduced and discussed. Another approach to improve the power budget involves increasing the power throughput of the device by combining highpower-handling silicon nitride waveguides with silicon waveguides that offer good mode confinement and efficient light modulation. An example of a multi-layered-integrated OPA is shown in Fig. 8, with similar works detailed in Table 3. To extend the field of view beyond the aliasing-limited scanning range, methodologies for aperiodic array design are introduced, with achieved beam quality summarized in Table 4. In addition to aperiodic arrays, uniform arrays of vernier difference can be paired into a bi-static LiDAR system. Leveraging the mismatch between transmitting and receiving OPAs, this approach achieves high side-mode suppression over a broad field of view. Recent progress in such bi-static vernier arrays is listed in Table 5. Conclusions and Prospects In summary, all current performance achievements for OPA-based solutions are compiled in Table 6 and compared against nominal LiDAR specifications. It is evident that, except for the maximum detectable range and point rate, most LiDAR specifications have been met. This underscores the technology's high readiness, especially with ongoing efforts to address longer-range operations through reduced insertion loss, on-chip amplification, and optimized throughput. Achieving a higher point rate will require a parallel multi-beam operation to surpass the measurement rate limited by photon round-trip travel time. Furthermore, there is a need for further investigation into challenges like chip yield, system-level integration during prototyping, as well as calibration and control during and after manufacturing. Simultaneously, adopting and leveraging advanced features such as adaptive scanning necessitates collaboration among LiDAR users and other stakeholders in the ecosystem.