Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics
Wanchun Yang,Wenbo Zhu,Xiaoting Wang,Shaowei Hu,Peng Cui,Yi Fang,Zhengyu Li,Fang Qi,Haiyang Cao,Haipeng Xu,Mingyu Li
DOI: https://doi.org/10.1016/j.matlet.2023.135675
IF: 3
2023-12-22
Materials Letters
Abstract:In this work, anti-oxidative single-phase Ag-Cu supersaturated solid-solution nanoparticles (Ag-Cu SS-NPs) were synthesized by a one-step method to serve as packaging materials for high-temperature power electronics. After sintering at 250 °C in air, a dense supersaturated structure with nano-sized Cu precipitates and coherent twins, high shear strength over 133 MPa and low resistivity (4.35 μΩ·cm) were obtained. Notably, the supersaturated structure with nano-sized Cu precipitates enhanced the thermomechanical properties and high-temperature stability. The high-temperature shear strengths of the sintered Ag-Cu joints reached remarkable 93.5 MPa at 300 °C. Meanwhile, the room-temperature shear strength of the sintered Ag-Cu SS-NP joints after aging at 300 °C for 500 h was maintained at 98.7 MPa, doubling that of the sintered Ag joints. Hence, the Ag-Cu SS-NP paste presents excellent feasibility and potential for high-temperature power electronics.
materials science, multidisciplinary,physics, applied