Research on the Preparation and Road Performance of Modified Epoxy Resin Chip Seal

Jie Wang,Jianhui Xu,Min Wang,Zengheng Hao,Li Xiao,Pan Liu,Fei Shang,Xiaowen Yue,Hao Huang,Shiqi Chen
DOI: https://doi.org/10.1088/1742-6596/2783/1/012043
2024-01-01
Journal of Physics Conference Series
Abstract:In order to explore the road performance of modified epoxy resin on cement concrete surfaces, based on the modified epoxy resin and flexible curing agent, the road performance of modified epoxy resin chip seal with different pavement structures and binder dosage was studied. When using the premixed structure with 3 to 5 mm gravel, the friction coefficient value of the chip seal was 48, the 7d wet wheel wear value was 254.5 g/m2. When using the layered structure with 3 to 5 mm gravel, the friction coefficient value of the chip seal was 84. The bond strength between the modified epoxy chip seal and the cement concrete surface was 3.13 MPa using the layered structure. The research results showed that the road performance of the layered structure chip seal was better than that of the premixed structure chip seal. The chip seal with a layered structure was more suitable for the preventive maintenance of cement concrete pavement.
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