Online Bridge-Level Junction Temperature Evaluation of IGBTs Via Emitter Parasitic Inductance Voltage Undershoot

Xinbin Fang,Pengju Sun,Bo Wang,Quanming Luo,Xiong Du
DOI: https://doi.org/10.1109/tie.2024.3392995
IF: 7.7
2024-01-01
IEEE Transactions on Industrial Electronics
Abstract:Insulated gate bipolar transistor (IGBT) junction temperature evaluation is vital for health assessment. However, most of the existing IGBT junction temperature ( T j ) evaluation approaches require the same number of detecting units and IGBTs. In this article, a thermosensitive electrical parameter based on the turn-OFF induced voltage v eE undershoot between Kelvin and power emitters of lower IGBT for two IGBTs junction temperatures estimation in half-bridge module is proposed, which is independent of bond wires fatigue. The v eE ringing of lower IGBT under designed time sequence has a good linear dependency with T j of upper and lower IGBTs. An improved peak detector circuit is designed to extract the v eE with no disruption to normal operation. Double-pulse test and three-phase converter platforms are built to verify the feasibility of industrial applications. Calibration results show that there is good linearity and high sensitivity between IGBT junction temperature and v eE undershoot under various working conditions. Besides, the approach has high accuracy in junction temperature monitoring validated by infrared. Therefore, this novel bridgelevel T j estimation method has a good commercial prospect.
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