Accurate Two-Dimensional Simulation Model and Experimental Demonstration in Ultraviolet Picosecond Laser Scribing Ablation

Zhiying Xu,Nan Zhao,Caijie Zhang,Shixian Cai,Kai Wang,Kedong Wang,Jiaming Li,Qingmao Zhang,Xueqing Yan,Kun Zhu
DOI: https://doi.org/10.1364/oe.524351
IF: 3.8
2024-01-01
Optics Express
Abstract:Laser patterning of copper thin films is essential for the electronics manufacturing industry. In this work, to efficiently and accurately describe the physics process of UV-ps laser ablating copper thin film, a two-temperature model (TTM) consisting of the electron-lattice system and phase explosion mechanism was proposed. The process of electron heating and electron-lattice heat transfer in single pulse ablation were revealed. The average relative errors (ARE) of simulated ablation depth and width were 6.24% and 4.82%, respectively. The process of laser scribing ablation presents the characteristics of repeated ablation in the overlapping ablation region and new ablation in the non-overlapping region. The physics essence of laser scribing is the multiple laser ablations with different energies on the cross-section. The laser scribing cross-section ablation was simulated on 2D TTM. Compared with 3D simulation, though the ARE of ablation depth and width of 2D simulation slightly increased from 15.81% and 5.69% to 18.96% and 8.76%, respectively, the average solving time decreased significantly, from 81960 s to 2140 s. This comprehensive study aims to offer some insights into the characteristics of UV-ps laser ablation of copper thin film.
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