Influence of (111) Texture on Bonding Strength in Low-Temperature Bonding of Nanotwinned Ag Films: Experimental Insights and Void Closure Modeling

Dashi Lu,Hao Pan,Xiuqi Wang,Ying Zhong,Rongpei Shi,Hongjun Ji
DOI: https://doi.org/10.1016/j.matdes.2024.112839
IF: 9.417
2024-01-01
Materials & Design
Abstract:Low -temperature bonding of nanotwinned (NT-) metals holds great potential for enhancing the performance and reliability of electronic interconnections. In this study, we performed low -temperature bonding of (1 1 1) -oriented nanotwinned silver (NT-Ag) films and thoroughly investigated the influence of (111) texture on the interfacial microstructure and bonding strength of the joints. The results demonstrated that high -quality bonding of highly (1 1 1) -oriented NT-Ag films was achieved even at 200 degrees C in air. The defect -free, coherent Ag(1 1 1)Ag (111) bonding interface was formed via face-to-face bonding of the highly (111) -oriented columnar grains. The shear strength of the joints significantly increased with the rise in (1 1 1) texture intensity. Moreover, we developed the void closure model to quantitatively elucidate the contribution of (1 1 1) texture to void closure and bonding ratio. Modeling results revealed that the (1 1 1) texture, with the highest surface diffusion coefficient, greatly increased the interfacial bonding ratio by accelerating surface source diffusion, thereby enabling high -strength bonding at low temperatures. The experimental validation and modeling results presented here contribute a novel perspective for optimizing interfacial microstructure and bonding strength by regulating the surface texture in the solid-state bonding of metals.
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