Effect of Bonding Temperature on Microstructure and Strength of High Nb Containing TiAl Alloy Diffusion Joints

Bao Panfei,Song Xiaoguo,Wang Xinbo,Hu Shengpeng,Peng Heli,Li Zhongquan
2018-01-01
Rare Metal Materials and Engineering
Abstract:The direct diffusion bonding of high Nb containing TiAl alloy (TAN) was conducted at temperatures of 1000 similar to 1200 degrees C for 90 min under 25 MPa in vacuum. The effect of bonding temperature on interfacial microstructure and mechanical property of joints was studied and the microstructure of joints was analyzed by SEM, EDS, XRD and EBSD. The results indicate that the distinct interface can be seen when the temperature is below 1100 degrees C, and the temperature higher than 1100 degrees C promotes disappearance of the interface; recrystallized grains are observed at bonding interface. The number and size of grains increase with the increase of temperature and a lot of alpha(2) phases appear in the area of recrystallization; when the connection temperature reaches 1150 degrees C, the average shear strength of joints reaches a maximum of 105 MPa.
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