Abstract:Ductile-regime machining has been used to generate damage-free surface of hard and brittle materials by setting the cutting depth to be smaller than the ductile-brittle transition depth (DBTD). However, the ductile-regime cutting of sapphire remains challenging owing to its extreme hardness, small DBTD, serious surface fractures, and severe tool wear. To solve this problem, ion implantation-assisted elliptical vibration cutting (Ii-EVC) has been proposed in this study to enhance the machinability of hard and brittle materials. Taking sapphire as an example, high-energy phosphorus ions were implanted into the workpiece to modify its surface. Nanoindentation tests revealed that the modified materials undergo plastic and elastic deformation more easily due to the decrease in hardness and modulus. Compared with nanocutting without implantation assistance, the DBTD of implanted sapphire has been increased by more than five times. The advantageous effects of Ii-EVC achieve great enhancement in machinability, including surface fractures suppression, tool-wear reduction, chips morphology transformation from discontinuous to continuous, and cutting force decrease. Furthermore, even near the cracks in the brittle region after Ii-EVC, the subsurface microstructure showed a more complete lattice arrangement and a strain distribution close to zero, indicating that crack propagation was effectively suppressed. Due to the promoted localized plastic deformation, the stress distribution in the implanted material is much smaller than that in pristine workpiece. Implantation-induced defects not only serve as a core for absorbing external energy from the high-frequency vibration and improving the in-grain deformation but also facilitate the formation of shear bands. The interface with high distortion between the modified layer and substrate can effectively dissipate strain energy and hinder crack propagation to the free surface. The turning experiments verified that Ii-EVC can achieve better surface quality, less tool wear and higher optical transmittance. Overall, Ii-EVC addresses the challenges of tool breakage and surface fracture caused by high-frequency collision between tool and workpiece in traditional EVC, overcomes the problem of limited modification depth in ion implantation, and increases the ductile-regime removal depth of extremely hard and brittle materials to several microns. Such findings demonstrate that Ii-EVC is a promising method for the ultra-precision manufacturing of advanced materials.

A Theoretical and Experimental Investigation on the Surface Formation Mechanism in Elliptical Vibration Cutting of Single Crystal Magnesium Fluoride

Machinability of Single Crystal Calcium Fluoride by Applying Elliptical Vibration Diamond Cutting

Sculpturing of single crystal silicon microstructures by elliptical vibration cutting

Cutting Depth-Oriented Ductile Machining of Infrared Micro-Lens Arrays by Elliptical Vibration Cutting.

Analytical modeling of subsurface damage and material removal energy in elliptical vibration cutting of micro-structures on brittle materials

Ductile Machining of Optical Micro-Structures on Single Crystal Germanium by Elliptical Vibration Assisted Sculpturing.

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

Experimental Study on Elliptical Vibration Cutting for Optical Microstructures

A Simulation Investigation on Elliptical Vibration Cutting of Single-Crystal Silicon

A Study on Micro-Machining Spinel by Applying Ordinary Cutting and Ultra-Sonic Elliptical Vibration Cutting

Fundamental Investigation of Ultra-Precision Ductile Machining of Tungsten Carbide by Applying Elliptical Vibration Cutting with Single Crystal Diamond

Investigation on the Material Removal Mechanism in Ion Implantation-Assisted Elliptical Vibration Cutting of Hard and Brittle Material

Investigation on the Machinability of Polycrystalline ZnSe by Elliptical Vibration Diamond Cutting.

Ultrasonic End Fly Cutting of Micro-Structured Surfaces on Single-Crystal Brittle Materials

The Mechanism for Material Removal in Ductile Mode Cutting of CaF 2 Brittle Crystals

Feasibility investigation on ductile machining of single-crystal silicon for deep micro-structures by ultra-precision fly cutting

Theoretical and numerical studies of surface microstructural transformation in ultrasonic elliptical vibration cutting tungsten heavy alloys

Research on Micro-surface Formation Mechanism of Ultrasonic Elliptical Vibration Cutting

Modulated ultrasonic elliptical vibration cutting for ductile-regime texturing of brittle materials with 2-D combined resonant and non-resonant vibrations

Influence of Clearance Angle on Micro/nano Structure Fabrication in Elliptical Vibration Cutting of Hardened Steel

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practical nominal cutting velocity