Abstract:Computing capacity has always been on the upward climb due to the constant technological improvements in semiconductor manufacturing and packaging industry. This growth in computing capability is usually accompanied by a steep rise in heat flux density associated with the electronic component (CPUs or GPUs, for example). High-performance computing (HPC) data centers often employ several of these high-performance devices for crunching their enormous artificial intelligence (AI) or scientific computing workloads. State-of-the-art air cooling technologies throttle after a certain heat flux level and would require bigger heat sinks driving enormous airflow through it, which may not be desirable from a data center operation standpoint. Hence, a lookout for advanced thermal management techniques is quite imperative. In this article, a commercially available intel overclockable CPU i9-9900k was exercised with high performance workloads while employing and evaluating three different cooling technologies namely air-cooled, cold plates, and two-phase (2P) immersion. The high heat carrying capacity associated with cold plates and 2P immersion techniques outperformed the air-cooled solution by constantly yielding higher CPU clock rates up to 41% utilizing cold plates and 51% employing 2P immersion. The performance of cold plates and 2P immersion was evaluated at different functional points (different coolant operating temperatures and 2P coolant types for example) to understand how the technologies would respond in a legacy or modern data center operation. It was again observed that both 2P immersion technology and cold plates provided the least thermal resistance (as low as 0.247 °C/W) path to heat transfer and therefore provided higher computational performance and efficiency compared to air cooling. Further improvement in performance is not limited by cooling but by packaging constraints. Advanced packaging techniques-coupled with minimizing the interfacial resistance can reap enhanced performance and energy efficiency gains using these modes of cooling. This article demonstrates the potential increase in virtual machine (VM) performance that can be attained using cold plates or 2P immersion. Authors recommend adoption of liquid cooling in early chip design and architecture phases. Finally, the article provides a generic overclocking methodology that the industry can use to qualify postturbo server class chip performance.

Computational Sprinting on a Hardware/software Testbed

Utilizing Dark Silicon to Save Energy with Computational Sprinting

On-chip phase change heat sinks designed for computational sprinting

Optimal Sprinting Pattern in Thermal Constrained CMPs

NoC-Sprinting: Interconnect for Fine-Grained Sprinting in the Dark Silicon Era

SprintCon: Controllable and Efficient Computational Sprinting for Data Center Servers.

Making data center computations fast, but not so furious

Temperature-aware Test Scheduling for Multiprocessor Systems-on-chip

Runtime Performance Optimization of 3-D Microprocessors in Dark Silicon.

Rapid Generation of Thermal-Safe Test Schedules

Alleviating Thermal Constraints While Maintaining Performance Via Silicon- Based On-chip Optical Interconnects

Pitfalls of Accurately Benchmarking Thermally Adaptive Chips

Enabling New Computation Paradigms with HyperFET - an Emerging Device.

CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling

Potential and Limitation of High-Frequency Cores and Caches

Alleviating Thermal Constraints While Maintaining Performance Via Silicon-Based On-Chip Optical Interconnects

Dynamic Voltage and Frequency Scaling for Intermittent Computing

SmartReflex Power and Performance Management Technologies for 90 nm, 65 nm, and 45 nm Mobile Application Processors

COP: A Combinational Optimization Power Budgeting Method for Manycore Systems in Dark Silicon

HW/SW Co-Optimization for Stencil Computation: Beginning with a Customizable Core

Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill