Abstract:Computing capacity has always been on the upward climb due to the constant technological improvements in semiconductor manufacturing and packaging industry. This growth in computing capability is usually accompanied by a steep rise in heat flux density associated with the electronic component (CPUs or GPUs, for example). High-performance computing (HPC) data centers often employ several of these high-performance devices for crunching their enormous artificial intelligence (AI) or scientific computing workloads. State-of-the-art air cooling technologies throttle after a certain heat flux level and would require bigger heat sinks driving enormous airflow through it, which may not be desirable from a data center operation standpoint. Hence, a lookout for advanced thermal management techniques is quite imperative. In this article, a commercially available intel overclockable CPU i9-9900k was exercised with high performance workloads while employing and evaluating three different cooling technologies namely air-cooled, cold plates, and two-phase (2P) immersion. The high heat carrying capacity associated with cold plates and 2P immersion techniques outperformed the air-cooled solution by constantly yielding higher CPU clock rates up to 41% utilizing cold plates and 51% employing 2P immersion. The performance of cold plates and 2P immersion was evaluated at different functional points (different coolant operating temperatures and 2P coolant types for example) to understand how the technologies would respond in a legacy or modern data center operation. It was again observed that both 2P immersion technology and cold plates provided the least thermal resistance (as low as 0.247 °C/W) path to heat transfer and therefore provided higher computational performance and efficiency compared to air cooling. Further improvement in performance is not limited by cooling but by packaging constraints. Advanced packaging techniques-coupled with minimizing the interfacial resistance can reap enhanced performance and energy efficiency gains using these modes of cooling. This article demonstrates the potential increase in virtual machine (VM) performance that can be attained using cold plates or 2P immersion. Authors recommend adoption of liquid cooling in early chip design and architecture phases. Finally, the article provides a generic overclocking methodology that the industry can use to qualify postturbo server class chip performance.

On-chip phase change heat sinks designed for computational sprinting

Computational Sprinting on a Hardware/software Testbed

Transient Performance of a Thermal Energy Storage-Based Heat Sink Using a Liquid Metal As the Phase Change Material

Self-adaptive Passive Temperature Management for Silicon Chips Based on Near-Field Thermal Radiation

Optimal Sprinting Pattern in Thermal Constrained CMPs

Utilizing Dark Silicon to Save Energy with Computational Sprinting

Accelerating Phase-Change Heat Conduction Simulations on GPUs

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Effect of melting temperature and amount of the phase change material (PCM) on thermal performance of hybrid heat sinks

Thermal Performance Characterization of Stacked Silicon Microcoolers for Spatially Non-Uniform Power Dissipation

CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Heat Dissipation Characteristics of a Jetting Staggered Microchannel for Cooling a Large-area High-performance SOC Chip

Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs

Efficient Thermal Energy Management of Hollow Pin Fin Heat Sinks with and without Phase Change Material

Optimizing performance for cooling electronic components using innovative heterogeneous materials

Phase-change materials for thermal management of electronic devices

From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0

Exploring thermal response in aluminum heat sinks with variable surface roughness for enhanced cooling

Three-dimensional Multiprocessor System-on-chip Thermal Optimization

Assessment of Thermal Management Using a Phase-Change Material Heat Sink under Cyclic Thermal Loads