Abstract:A multi-layer stacked Dynamic Random Access Memory (DRAM) platform is introduced to address the memory wall issue. This platform features high-density vertical interconnects established between DRAM units for high-capacity memory and logic units for computation, utilizing Wafer-on-Wafer (WoW) hybrid bonding and mini Through-Silicon Via (TSV) technologies. This 3DIC architecture includes commercial DRAM, logic, and 3DIC manufacturing processes. Their design documents typically come from different foundries, presenting challenges for signal integrity design and analysis. This paper establishes a lumped circuit based on 3DIC physical structure and calculates all values of the lumped elements in the circuit model with the transmission line model. A Cross-Process Signal Integrity Analysis (CPSIA) method is introduced, which integrates three different manufacturing processes by modeling vertical stacking cells and connecting DRAM and logic netlists in one simulation environment. In combination with the dedicated buffer driving method, the CPSIA method is used to analyze 3DIC impacts. Simulation results show that the timing uncertainty introduced by 3DIC crosstalk ranges from 31 ps to 62 ps. This analysis result explains the stable slight variation in the maximum frequency observed in vertically stacked memory arrays from different DRAM layers in the physical testing results, demonstrating the effectiveness of this CPSIA method.

Timing Analysis and Design for DDR3 System

Co-Design of DDR3 System Based on Mixed Modeling

Design of the DDR SDRAM Controller Integrated by the Data Intensive Computing Architecture

Design Of A Dynamic Memory Access Scheduler

Design and Implementation of A Ddr3-Based Memory Controller

SDRAM Interface Design for Video Processing Algorithm

Design and Implementation of DDR3 SDRAM Controller

Physical Design of 2 133 Mb/s DDR3 Memory Interface

Simulation and Design of DDR SDRAM Data Bus Layout in Mobile Terminals

The design of DDR2 SDRAM controller data-path

Design of DDR3 protocol parsing logic based on FPGA

A Modeling and Computational Analysis Method for Multichip DDR Microsystem

A Cross-Process Signal Integrity Analysis (CPSIA) Method and Design Optimization for Wafer-on-Wafer Stacked DRAM

Design and verification of DDR3 arbitrator on FPGA

Hardware Implementation of a High Performance and Low Power DDR2 Controller

DDR Controller Design for STB with Low SSN

Challenges in implementing DDR3 memory interface on PCB systems: a methodology for interfacing DDR3 SDRAM DIMM to an FPGA

Optimal Design Of Ddr3 Stt-Mram Memory

Design of DDR2 interface data acquisition based on Spartan-3A

A Bit-Rearrangement Based Method to Reduce SSN of DDR Interface in STB Chip Design

Design of 3D DRAM and Its Application in 3D Integrated Multi-Core Computing Systems