Message from the Technical Program Chair and Co-Chairs

Cheng Wang,Qiang Cheng,Kuang Zhang,Lin Sheng Wu,Ming Chun Tang,Bing Zhang
DOI: https://doi.org/10.1109/imws-amp57814.2023.10381049
2023-01-01
Abstract:On behalf of the Technical Program Committee (TPC), we warmly welcome all of you to the 2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2023) in Chengdu.
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