Message from the Technical Program Chairs: IEEE BDS 2024

Hiroyuki Fujioka,Katerina Potika,Junchi Yan

DOI: https://doi.org/10.1109/bigdataservice62917.2024.00005

2024-01-01

Abstract:On behalf of the Technical Program Committee, we proudly present the proceedings of the IEEE BDS 2024 conference, held in Shangai (China) from July 15-18, 2024.

What problem does this paper attempt to address?

Guest editorial: Selected papers from IEEE/CIC ICCC2014

Liu, Jing,Chen, Jiming,Yao, Mingwu

DOI: https://doi.org/10.1109/CC.2015.7084378

2015-01-01

Abstract:Since its successful inauguration in Beijing, August, 2012, the IEEE international Conference on Communications (ICCC) has been globally recognized as one of the important annual international conferences held by the IEEE Communication Society (ComSoc) and China Institute of Communications (CIC). IEEE/CIC ICCC'14, the third ICCC held in Shanghai, China, 13–15 October, 2014, continued to expand its influence and had attracted distinguished scholars, key researchers, young investigators and ambitious students from dozens of countries and regions. The technical program of ICCC 2014 features 4 world-class plenary keynote speeches, 8 technical symposia, 5 tutorials, 4 industrial and academic panels and 1 workshop, covering from decades-long hot topics such as MIMO, interference coordination, heterogeneous networks and etc., to recent eye-catchers such as big data and social networks. The conference not only provided a forum and seminar for active researchers from every directions of this academia, but also attracted delegates from the main players in the industry.
2024 IEEE International Conference on Cloud Computing, Message from the Chairs

Tevfik Kosar,Krishnan Venkateswaran,Shangguang Wang,Seetharami Seelam,Santonu Sarkar,Xuanzhe Liu

DOI: https://doi.org/10.1109/cloud62652.2024.00008

2024-01-01

Abstract:We are delighted to welcome all participants to the 2024 IEEE International Conference on Cloud Computing (CLOUD 2024), which is taking place in the beautiful city of Shenzhen, China, from July 7th to 13th.
Message from the General Chairs; IEEE CSCloud/EdgeCom 2024

Zhihui Lv,Jihe Wang,Sun-Yuan Kung

DOI: https://doi.org/10.1109/cscloud62866.2024.00005

2024-01-01

Abstract:Representatives of collaborating organizations, delegates from all supporters, it is our great pleasure and honor as General Chairs of IEEE CSCloud/EdgeCom 2024 to welcome you to the 11th IEEE International Conference on Cyber Security and Cloud Computing (IEEE CSCloud 2024), the 10th IEEE International Conference on Edge Computing and Scalable Cloud (IEEE EdgeCom 2024), and the co-located events. IEEE CSCloud/EdgeCom 2024 Committees organize these two co-located conferences.
Message from the Program Chairs; ICHI 2024

Yanshan Wang,Yifan Peng,Mei Liu,Xinning Gui,Zhengxing Huang,Gregor Stiglic

DOI: https://doi.org/10.1109/ichi61247.2024.00123

2024-01-01

Abstract:Welcome from the Program Chairs of the 12 th IEEE International Conference on Healthcare Informatics (IEEE-ICHI). IEEE ICHI 2024 received 135 papers for the three major paper tracks: Analytics, Human Factors, and Systems.
Message from IEEE BigData 2019 Program Chairs

Ju Ren,Shadi Ibrahim,Xiaokang Zhou

DOI: https://doi.org/10.1109/trustcom/bigdatase.2019.00008

2019-01-01

Abstract:Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.
DMDCM 2011 Foreword

Liu Yong,Abdennour El Rhalibi,Zhang Ming-min

2011-01-01

Abstract:We are pleased to present a collection of high-quality papers covering all aspects of digital media, digital content, multimedia technology, visualization and transmission, computer animation, and social agents We trust that this edition will provide the digital media, digital content, and computer animation community with a varied selection of high-quality research efforts and results. The work of numerous people is essential in the success of the two events. We first thank the members of the Program Committee for their crucial role in ensuring the quality of the conference. We thank all of the local organizers for their hard work in preparation of and during the actual conference. We also thank the sponsors for their generous support. Finally, we wish to thank the staff of the IEEE Conference Publishing Services for their kind assistance in the publication of the conference proceedings.
Preface: 4th International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2024)

Haifeng Hu,Beau Adams

DOI: https://doi.org/10.62051/jqegqh62

2024-09-13

Abstract:The organizing committee of MEIT 2024 was proud to present the proceedings of the 4th International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2024), held on July 27-28, 2024 in Dalian, China. The aim as well as objective of ICMEIT Conference is to present the latest research and results of scientists related to Mechatronics Engineering and Information Technology and related topics. This conference provides opportunities for the delegates to exchange new ideas face-to-face, to establish business or research relations as well as to find global partners for future collaborations. We hope that the conference results will lead to significant contributions to the knowledge in these up-to-date scientific fields. This two-day conference is being organized in technical association with Asian Union of Information Technology, Research Center of Engineering and Science, and include invited keynote talks and oral paper presentations from both academia and industry to ignite our young minds, to initiate them in the field of meaningful research and thereby enrich their existing knowledge. 4th ICMEIT has received 51 manuscripts. All full paper submissions to this conference would send to at least two reviewers and evaluated based on originality, technical or research content, correctness, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program. Hopefully, all participants and other interested readers benefit scientifically from the proceedings and also find it stimulating in the process. With our warmest regards, Haifeng Hu, Beau Adams Dalian, China
Message from the Workshop Chairs; COMPSAC 2024

A. K. M. Jahangir Alam Majumder,Yoshiaki Hori,Ji-Jiang Yang

DOI: https://doi.org/10.1109/compsac61105.2024.00008

2024-01-01

Abstract:It is our great pleasure to welcome you to the workshops of the 48th IEEE International Conference on Computers, Software, and Applications (COMPSAC 2024), which is held in the Osaka, Japan, on July 2 - 4, 2024. The theme of COMPSAC 2024 is “Digital Development for a Better Future”. The IEEE COMPSAC is well established in its 48th edition as a highly reputed conference in the field of computer software and applications. Digital development at COMPSAC 2024 will focus on research and development of computing technologies for their eventual integration into all aspects of society.
2010 IEEE International Conference on Bioinformatics and Biomedicine Workshops

Diego di Bernardo,Ting Fung Chan,Jake Chen,Xin Chen,Xuewen Chen,Yidong Chen,Xiaodong Cheng,H Gue Cho,Young-Rae Cho,Francisco Couto,Ramana V Davuluri,Lin Gao,Pietro Hiram Guzzi,Chuhsing Kate Hsiao,Hui-Huang Hsu,Luke Jun Huan,Kun Huang,Yufei Huang,Rui Jiang,William Klement,Guo-Zheng Li,Bo Luo,Martin Michalowski,Jurg Ott,Quan Pan,Taesung Park,Linda Pattini,Brian Potetz,Xiaofeng Song,Dympna O'Sullivan,Hao Sun,Vincent S Tseng,Yiqin Wang,FangXiang Wu,Dan Xi,Siu Ming Yiu,Shaowu Zhang,Zhongming Zhao,Huiru Zheng

2010-01-01

Abstract:The papers in this book comprise the proceedings of the meeting mentioned on the cover and title page. They reflect the authors' opinions and, in the interests of timely dissemination, are published as presented and without change. Their inclusion in this publication does not necessarily constitute endorsement by the editors, the IEEE Computer Society, or the Institute of Electrical and Electronics Engineers, Inc.
Message from the High Performance Computing and Communications 2022 Program Chairs

Yunquan Zhang,Jidong Zhai,Rajiv Ranjan

DOI: https://doi.org/10.1109/hpcc-dss-smartcity-dependsys57074.2022.00007

2022-01-01

Abstract:It is our great pleasure to welcome you to HPCC 2022, the 24th IEEE International Conference on HPCC, held in Chengdu, China, on December 18-21, 2022. IEEE HPCC 2022 is sponsored by IEEE, IEEE Computer Society, IEEE Technical Committee on Scalable Computing, Task Force on Cyber-Physical-Social Systems of IEEE Smart World Technical Committee, and is organized by Sichuan University, and Hainan University.
Message from the Program Chair: ICoSR 2022

Tao Liu

DOI: https://doi.org/10.1109/icosr57188.2022.00006

2022-01-01

Abstract:We are excited to welcome you to the 2022 International Conference on Service Robotics (ICoSR 2022)! Once again, the ICoSR research community cannot meet in person, because of the COVID-19 pandemic; originally, we planned and hoped for at least a hybrid conference to be hosted in Xishuangbanna, China. In order to create safe, meaningful, and wanted human-robot interactions for people and society, to create new ways of thinking about our future lives with robotic technology, virtual conference is essential. The ICoSR Conference is presenting topquality research and the virtual format might even allow us to attract and include more people who would not have the opportunity to travel to China.
Message from IEEE BigData 2019 General Chairs

Xuemin Shen,Yaoxue Zhang,Beniamino Di Martino

DOI: https://doi.org/10.1109/trustcom/bigdatase.2019.00009

2019-01-01

Abstract:Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.
Preface: 9th International Conference on Computer-Aided Design, Manufacturing, Modeling and Simulation (CDMMS 2024)

Katherine Tate,Shiqi Duan

DOI: https://doi.org/10.54097/vvynht65

2024-06-26

Abstract:This proceeding is a collection of invited contributions from the presenters and the participants of the 2024 9th International Conference on Computer-Aided Design, Manufacturing, Modeling and Simulation (CDMMS 2024), held in Busan, South Korea during May 11-12, 2024. The aim of this conference is to present the latest research and results of scientists related to computer-aided design, advanced manufacturing, modeling, and simulation topics. CDMMS 2024 provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these scientific fields. Distinguished researchers from South Korea, China, India, and Hong Kong (China) were invited to deliver keynote address regarding the latest research discoveries in their respective areas of expertise. Each presentation made by authors was confined in 20 minutes, following by questions and answers. We hope that all the participants will get large opportunities to widen their knowledge and network. All accepted papers were subject to peer-review by conference committee and invited reviewers. The papers were selected based on their quality and their relevance to the conference. We would like to thank the reviewers for their valuable time and advice which helped in improving the quality of the papers selected for presentation at the conference and for publication in the proceedings. Warm regards, Conference Organizing Chair Busan, South Korea
2009 IEEE 28th International Performance Computing and Communications Conference, IPCCC 2009: Message from the program chairs

Sheng Zhong,Kuai Xu

DOI: https://doi.org/10.1109/pccc.2009.5403799

2009-01-01

Abstract:Welcome to the 28th IEEE Performance Computing and Communications Conference (IPCCC 2009). On behalf of the technical program committee, we would like to thank all the authors for the high quality of their papers that are accepted either by the IPCCC main conference or by the workshops held in conjunction with the IPCCC.
Selected papers from IEEE ICCT 2023

Feng Wei,Li Changle,Zhao Haitao,Jin Shi,Zhu Hongbo

DOI: https://doi.org/10.23919/jcc.2024.10771943

2024-12-04

China Communications

Abstract:IEEE International Conference on Communication Technology (ICCT) was jointly initiated and organized by IEEE Beijing Section and IEEE ComSoc in 1986. It is one of the highest-level academic events in the field of communication technology in China. It is also an international gathering for research for information and communication technology. IEEE ICCT 2023 was held in Wuxi, China on October 20–22, 2023. The key theme is "Advanced Communication and Internet of Things", which extensively covers the theoretical and practical innovations in the area of communications.

telecommunications
Greetings from Program Chairs

Pavan Balaji,Wenguang Chen,I-Hsin,I-Lin Yen,Shui Yu,Hung-Min Sun,Haiwu He,Wei Zheng,Whai-En Chen,Yung-Hsiang Lu,Weining Qian,Jianzong Wang

DOI: https://doi.org/10.1109/icmlc48188.2019.8949235

2019-01-01

Abstract:Welcome to the proceedings of the 2015 International Conference on Cloud Computing and Big Data, held in Shanghai, China from November 4-6, 2015. With the themes of Big Data, Analytics, Cloud Computing, Mobile/IoT, Social Networking and their convergence, the conference is organized with 8 tracks including: Architecture & Foundation of Cloud Computing and Big Data, Software Engineering, Tools & Services for Cloud Computing and Big Data, Software as a Service, Big Data Analytics, Modeling and Applications, Security, Privacy, Trust & Quality of Cloud Computing and Big Data, Cloud and Context for Business Process Management and Big Data Applications, Mobile/IOT and Smart City, Social Networking, and Software Defined Everything (SDX).
Preface: 7th International Conference on Mechatronics, Control and Electronic Engineering (MCEE 2024)

Emmanuel Bloor,Rui Wang

DOI: https://doi.org/10.54097/8n5krp22

2024-05-28

Abstract:On behalf of the committee, we would like to thank you for your participation in the 2024 7th International Conference on Mechatronics, Control and Electronic Engineering (MCEE 2024) which has been held in Dallas, USA during April 13-14, 2024. The aim of this conference is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in mechanical engineering, electronic engineering, mechatronics engineering, control technology, automation, communication engineering, computer science and information technology. MCEE 2024 provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. Prominent researchers and scientists from around the world share their latest research results and exchange their ideas. In addition, direct contacts among the researchers and scientists will therefore promote international research networking as well as collaboration in the future. We would like to express our sincere appreciation to all the participants, financial sponsors, exhibitors, supporting organizations and all the committee members who has made this conference successful. We are looking forward to meeting you in the next MCEE conference. MCEE 2024 Conference Committee Dallas, USA
Proceedings of the 16th ACM International Symposium on Mobile Ad Hoc Networking and Computing

Sherman Shen,Youxian Sun,Jiming Chen,Junshan Zhang,Gil Zussman

2015-01-01

Abstract:On behalf of the Technical Program Committee, we would like to welcome you to ACM MobiHoc 2015 in Hangzhou, China. ACM MobiHoc is the premier international symposium dedicated to addressing challenges emerging from wireless networking and computing. The highly selective technical program has traditionally brought together a unique blend of researchers and practitioners, thereby influencing the direction of a wide range of wireless networking research areas. We hope that you will find the conference intellectually stimulating. We are delighted to report that this year's program continues the tradition of excellence set by this conference over the years. We received 250 submissions, which has made it extremely challenging to select only 37 papers for presentation and inclusion in the proceedings. At such a selective acceptance rate (14.8%) many of the papers that we could not accept are of high quality and we are certain that many of them will appear in the near future at other top-tier conferences. The paper selection process was handled by the Technical Program Committee (TPC). The TPC included 65 excellent members with expertise spanning all the major areas relevant to the conference scope. In particular, the TPC was composed of members from 16 countries and included 11 members from research labs and industry. The 250 submitted papers went through a first phase of reviews followed by a very active online discussion phase. Then, several papers went through a second review phase. The reviews were provided by the TPC members and, when needed, a few reviews were provided by external expert reviewers. At the end of this process and based on the results of the online discussion, 12 papers were accepted and 46 papers were further discussed at the TPC meeting that was held on Feb. 28, 2015 at Columbia University in New York. Following the discussions at the meeting, 25 additional papers were accepted. Ten of the accepted papers were assigned shepherds who volunteered to assist the authors during the process of preparing the final version. The work of the TPC was outstanding and we thank all the members for the time and efforts they dedicated to the paper selection process and to attending the meeting. These efforts make this wonderful conference possible. We are pleased with the strong technical program of the conference, represented by the papers in these proceedings. The conference program covers a wide range of topics, including routing, scheduling, algorithms, performance evaluation, dynamic spectrum access, cellular networks, sensor networks, mobile applications and crowdsensing, security, and wireless systems. This year's program is preceded by a set of seven workshops. It continues the tradition of having keynote talks from outstanding leaders in the field, and it includes a poster/demo session. The keynote speakers are Prof. Ness B. Shroff, the Ohio Eminent Scholar in Networking and Communications at The Ohio State University, Prof. Wen Gao, Vice President of the NSF of China, and Prof. Andrea Goldsmith, the Stephen Harris Professor in the School of Engineering, Professor of Electrical Engineering at Stanford University.
Message from Data Science and Systems 2022 Program Chairs

Bin Cui,Chuan Li,Anwer Al-Dulaimi

DOI: https://doi.org/10.1109/hpcc-dss-smartcity-dependsys57074.2022.00027

2022-01-01

Abstract:It is our great pleasure to welcome you to DSS 2022, the 8th IEEE International Conference on DSS, held on December 18-21, 2022. For the IEEE DSS 2022, the financial sponsors are IEEE and IEEE Computer Society, the technical sponsors are IEEE Technical Committee on Scalable Computing, Task Force on Cyber-Physical-Social Systems of IEEE Smart World Technical Committee. The organizers of IEEE DSS 2022 are Sichuan University and Hainan University.
Message from the General Chair and Program Co-Chairs

Wei Zhang,Ray Cheung,Yun Liang,Hiroki Nakahara

DOI: https://doi.org/10.1109/ICFPT56656.2022.9974448

2022-01-01

Abstract:On behalf of the FPT'22 Organizing Committee, we appreciate all of you for joining FPT'22 both in-person or virtually. We wished we could say “Welcome to Hong Kong” to all the attendees, but the ongoing Covid-19 travel restrictions still make overseas travel inconvenient for some of the attendees. Hence, we have worked very hard to give good support to both the in-person and virtual attendees. We bring a hybrid mode FPT'22 and hope to connect all the attendees together to enjoy the exciting program.

Message from the Technical Program Chairs: IEEE BDS 2024

Guest editorial: Selected papers from IEEE/CIC ICCC2014

2024 IEEE International Conference on Cloud Computing, Message from the Chairs

Message from the General Chairs; IEEE CSCloud/EdgeCom 2024

Message from the Program Chairs; ICHI 2024

Message from IEEE BigData 2019 Program Chairs

DMDCM 2011 Foreword

Preface: 4th International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2024)

Message from the Workshop Chairs; COMPSAC 2024

2010 IEEE International Conference on Bioinformatics and Biomedicine Workshops

Message from the High Performance Computing and Communications 2022 Program Chairs

Message from the Program Chair: ICoSR 2022

Message from IEEE BigData 2019 General Chairs

Preface: 9th International Conference on Computer-Aided Design, Manufacturing, Modeling and Simulation (CDMMS 2024)

2009 IEEE 28th International Performance Computing and Communications Conference, IPCCC 2009: Message from the program chairs

Selected papers from IEEE ICCT 2023

Greetings from Program Chairs

Preface: 7th International Conference on Mechatronics, Control and Electronic Engineering (MCEE 2024)

Proceedings of the 16th ACM International Symposium on Mobile Ad Hoc Networking and Computing

Message from Data Science and Systems 2022 Program Chairs

Message from the General Chair and Program Co-Chairs