Abstract:Over the past decade, immersion lithography has been the primary technology for exposure process in semiconductor manufacturing. Compared with traditional dry lithography method, this technology improves the exposure resolution greatly by inserting a high index liquid into the gap between lens and wafer surface. Keeping the immersion liquid pure and uniform as well as avoiding residual droplets during high speed scanning motion are two challenges faced by the development of immersion lithography. Contaminations, particles, bubbles, heating and stress in the liquid will destroy the continuity of the refractive index. High speed motion of the wafer during scanning may break the meniscus stability on the interface between the liquid and the gas surrounding it, and then generate residual droplets on the wafer. All above phenomena will affect the exposure performance of immersion lithography and corresponding flow behavior control methods are required to solve the problems. This paper gives a review of the studies on flow behavior control in immersion lithography, which contains two parts: studies for liquid purity and uniformity and studies for meniscus stability. In each part, the mechanism and character of the flow behaviors as well as their effects to exposure performance are presented firstly. Then, control approaches adopted by now, including material and surface modifications as well as immersion head utilization, are introduced. In addition, the challenges faced in future studies are also pointed out. The purpose of this review paper is to help the researchers to understand the flow control problems in immersion lithography and to provide better control approaches for exposure performance improvement.

Cover Image, Volume 140, Issue 21

Developments and Prospects of Immersion Control System in Immersion Lithography Machine

Simulation and Experimental Investigation of Immersion Flow Field in Immersion Lithography

Research Status and Progress of Contamination Control in Immersion Liquid System of Immersion Lithography Machine

Cover Image, Volume 47, Issue 3

Optimization of Ion Implanter Hardware for Metal Contamination Reduction

Optimization of approach for metal contamination reduction

Cover Image, Volume 115, Number 7, July 2018

Flow Behavior Control in Immersion Lithography

Research on metallic contamination control of PFA injection molded fittings

Cover Image, Volume 140, Issue 36

Contamination Control in Semiconductor Manufacturing Processes

Cover Image, Volume 141, Issue 8

Large-area homogeneous corrosion process for electrochemical nanoimprint lithography on GaAs wafer by modulating contact pressure

Trace Metallic Contamination Analysis on Wafer Edge and Bevel by TXRF and VPD-TXRF

Outside Back Cover: Volume 3 Issue 3

Cover Picture: Materials and Corrosion. 5/2023

Inside Back Cover, Volume 2, Number 1, January 2023

Cover Image, Volume 141, Issue 22

Quantitative evaluation of residual resist in electron beam lithography based on scanning electron microscopy imaging and thresholding segmentation algorithm

Failure Analysis of the Contamination on the Pins of the SOT Packages