Preface to Special Issue on Electronic Electroplating

Zhi-Dong Chen,Chong Wang,Wei He,Ming Li
DOI: https://doi.org/10.13208/j.electrochem.210440
2022-01-01
Abstract:Electroplating is a process using electric current to deposit a layer of metal(s),which is an indispensable technique in the manufacture of integrated circuits and micro-nano electronic devices.Electroplating for modern electronics is much smaller in scale than the ordinary electroplating processes and relies heavily on foreign technique,such as proprietary materials and equipment.As the competition in the field of chip manufacture intensifies,we realize that there is no choice but to become self-sufficient in such tech-nology,including,but not limited to electroplating technology.
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