A Thermal-Shutdown Circuit for Modularized Design

ZHANG Xiao-kun,WANG Jian,XU Shang-lin,LIANG Jing,GONG Min
2007-01-01
Abstract:A thermal-shutdown circuit, which can be used as modularized design, is presented and has been simulated in 0.8μm BiCMOS technology. This circuit is sensitive to the change of temperature, do not need additional reference voltage and has very low static power. The circuit can be controlled with external signal, operated in power supply range from 1.5V to 12V and used as thermal-shutdown module in the power management and the interface circuit chips.
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