Effect of Substrate Temperature on Diamond Film on Boronized WC–6%Co Substrate

Xiaodong He
2006-01-01
China surface engineering
Abstract:The diamond film was deposited on a boronized WC–6%Co substrate via hot filament chemical vapor deposition. The surface morphology, composition and adhesion of the diamond film were investigated by means of field emission scanning electron microscope (FESEM), X–ray diffractometer (XRD) and Rockwell hardness tester, respectively. The results showed that a cobalt boride layer was formed on the surface at 950 ℃. The layer can effectively reduce the diffusion of Co from substrate to surface during the deposition of diamond films. Comparing with the two-step pretreatment, the boronizing is much better to improve the adhesion.
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