Reconfigurable Dual-Band High-PAE CMOS Power Amplifier

Zhiqiang Liu,Fei You,Zehua Xiao,Rongxing Qin,Jing Xu,Maojun Pan,Tao Wu,Songbai He
DOI: https://doi.org/10.1109/ICMMT58241.2023.10277041
2023-01-01
Abstract:In this paper, a power amplifier (PA) based on the TSMC 65 nm bulk CMOS process is proposed. The PA utilizes matching network and bias voltage reconfigurable technology to achieve dual-band high power added efficiency (PAE) operation. The proposed PA consists of a high gain driver and a main amplifier, which are respectively powered by 1.2 V and 2.5 V voltage. Simulation results demonstrate that on the frequency band of 0.3 GHz to 1.0 GHz, the power amplifier can achieve a saturated output power over 17.9 dBm, and the maximal PAE is more than 65%. In the band of 1.5 GHz to 2.4 GHz, the power amplifier can achieve a saturated output power over 17.2 dBm, and the maximal PAE is more than 51.5%. The chip area is 1.2 mm by 0.65 mm.
What problem does this paper attempt to address?