Significantly Enhancing Elevated-Temperature Strength and Ductility of a FeMnCoCr High-Entropy Alloy Via Grain Boundary Engineering: Exploring Multi-Deformation Mechanisms

Z. Y. You,Z. Y. Tang,F. B. Chu,H. Ding,R. D. K. Misra
DOI: https://doi.org/10.1016/j.msea.2023.145547
2023-01-01
Abstract:The objective of the study is to elucidate the influence of grain boundary engineering (GBE) on the high-temperature properties of a metastable FeMnCoCr high-entropy alloy (HEA). Using thermo-mechanical processing (TMP), the grain boundary character distribution (GBCD) was optimized, which involved the increase of coincidence site lattice (CSL) special boundaries and multiple twinning events, and breaking of random high-angle grain boundaries (RHAGBs) network. Furthermore, the deformation strain of the alloy became more uniform at high temperature, dynamic recrystallization was suppressed, and a number of deformation mechanisms were operative. The ductility of studied HEA was significantly enhanced by over 200% at 1073 K, resulting in a remarkable 1.35-fold increase.
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