Abstract:The microstructure evolution and growth mechanism of interfacial intermetallic compounds (IMCs) as well as the mechanism for early formation of cracks in Sn-3Ag-0.5Cu solder joints of quad flat packages (QFPs) during extreme temperature thermal shock between 77K and 423K were investigated. The Cu-Sn IMC layer at the Cu lead/solder interface and the Ni-Cu-Sn IMC layer at the solder/ENIG pad interface gradually thickened as well as the IMCs morphologies changed during extreme temperature thermal shock. Scallop-like Cu-Sn IMC layer and needle-like Ni-Cu-Sn IMC layer both transformed to plane-like IMCs. New Cu3Sn phase was formed at the interface between Cu lead and Cu6Sn5 IMC layer after 250 cycles. The (Ni, Cu)3Sn4 IMC layer was completely converted into (Cu, Ni)6Sn5 IMC layer after 150 cycles resulting from the diffusion of Cu atoms from Cu lead and Sn-3Ag-0.5Cu solder to the solder/pad interface. The time exponent (n) values of Cu-Sn and Ni-Cu-Sn IMC layers were 0.66 and 0.34, respectively, indicating that the controlling mechanisms for Cu-Sn and Ni-Cu-Sn IMC growth were bulk diffusion and grain-boundary diffusion, respectively. Cracks were formed both at the solder/Cu-Sn layer interface and at the solder/Ni-Cu-Sn layer interface after 250 cycles, due to the CTE difference between the solder and IMC, and to the thickened and flattened IMC layer. The great stress concentration resulting from the large temperature variation (∆T = 346K) led to the early formation of cracks. With the increase of thermal shock cycles, the pull strength of Sn-3Ag-0.5Cu solder joints decreased and the fracture location changed from within the solder to partly in Cu-Sn IMC layer and partly along the solder/Ni-Cu-Sn layer interface, which indicated that the fracture mechanism transformed from ductile fracture mode to brittle fracture mode.

Oxidation Behavior and Intermetallic Compound Growth Dynamics of SAC305/Cu Solder Joints under Rapid Thermal Shock

Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition

Effect of Ag Content on Microstructure and Mechanical Properties of Sn-xAg-0.5Cu Solder Joints under Rapid Thermal Shock

Comparative Study Between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG Solder Joints under Extreme Temperature Thermal Shock

Growth Behavior of Intermetallic Compounds and Early Formation of Cracks in Sn-3Ag-0.5Cu Solder Joints under Extreme Temperature Thermal Shock

Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints

Growth kinetics of (Cu<sub>x</sub>Ni<sub>1-x</sub>)<sub>6</sub>Sn<sub>5</sub> intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test

Interfacial Intermetallic Compound Growth in Sn-3Ag-0.5Cu/Cu Solder Joints Induced by Stress Gradient at Cryogenic Temperatures

Brittle fracture of intermetallic compounds in SAC solder joints under high speed ball pull/pin pull and Charpy impact tests

Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

Interfacial Reaction of Cu/SAC105/Cu Solder Joints Reinforced with Ti Nanoparticles under Vacuum Thermo-Compression Bonding

Effect of Nano-Cu6Sn5 Upon Development Mechanism of Cu–Ni–Sn Compounds and Mechanical Characteristics for Mixed Solder Joints

Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

Effect of High Temperature Thermal Aging on Microstructural Evolution of Sn3Ag0.5Cu/Cu Solder Joints

The Morphology and Kinetic Evolution of Intermetallic Compounds at Sn–Ag–Cu Solder/cu and Sn–Ag–Cu-0.5Al2O3 Composite Solder/cu Interface During Soldering Reaction

Effect of Nano-Cu 6 Sn 5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

Fatigue cracking growth of SAC305 solder ball under rapid thermal shock

Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment

Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface