Modulating Residual Stress Based on Atomic Layer Deposition to Enhance the Adhesion of Parylene C for Encapsulation of Flexible Organic Light-Emitting Diodes

Lianchao Shangguan,Zhenyu Wang,Ziqiang Chen,Siyu Fan,Chuannan Li,Jian Zhang,Muwei Wang,Yu Duan
DOI: https://doi.org/10.35848/1882-0786/acc781
IF: 2.819
2023-01-01
Applied Physics Express
Abstract:This paper proposes a method for enhancing the adhesion strength between parylene C and the substrate by depositing a layer of Al2O3 film with residual tensile stress on parylene C by atomic layer deposition. Compared with pretreatment using a coupling agent, it improves the adhesion strength by 2.4 times. The parylene C/Al2O3 hybrid film maintains a good barrier performance after 10 000 times of bending with a bending radius of 3 mm, with the water vapor transmission rate (WVTR) retained at 3.55 x 10(-4) g.m(-2).d(-1). Encapsulation of flexible organic light-emitting diodes is carried out using this hybrid film without a negative effect on the performance. (c) 2023 The Japan Society of Applied Physics
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