Influence of EMC Material Property on Stress and Interfacial Delamination of SCSP Device

Minghua Zhao
2009-01-01
Abstract:The dynamic mechanical analyzer was employed to determine the viscoelastic properties data of epoxy molding compound (EMC material). Based on the EMC material viscoelastic model, temperature-dependent elastic model and constant elastic model, finite element software MSC Marc was used to investigate the distribution of maximum equivalent stress and interfacial delamination of SCSP device during temperature cycling (–55~+125 ℃), respectively. The results show that the maximum equivalent stress at 125 ℃ and –55 ℃ are present to the overhang of top chip in constant elastic model and viscoelastic model, respectively; the equivalent stress of EMC material as constant elastic material is 15.10 MPa higher than viscoelastic model; the J-integral value at crack tip in viscoelastic model is increased by about 45% compared with constant elastic model at –55 ℃, and the cracks in viscoelastic model easy to cause propagation.
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