A novel low resistivity copper diffusion joint for REBa(2)Cu3O(7-d) tapes by thermocompression bonding in air

Wei Ren,Zhen Huang,Fangliang Dong,Yue Wu,Zhijian Jin
DOI: https://doi.org/10.9714/psac.2022.24.4.016
2022-01-01
Progress in Superconductivity and Cryogenics
Abstract:Applications of REBa2Cu3O7-delta tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-delta tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 degrees C and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 n Omega.cm(2) (resistance of 0.4 n Omega for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.
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