Abstract:The temperature field evolution and material removal process during picosecond (ps) laser micro-grooving of single crystalline germanium (Ge) are explored by developing a 2D two-temperature model (TTM). The transient temperature-dependent thermal and optical properties of electrons and lattice are incorporated for accurate calculations, and the electron-lattice coupling strength is estimated considering the electron transition from valence band (VB) to conduction band (CB) mainly caused by one photon absorption. Different material removal mechanisms, i.e. the thermal way caused by vaporization and the athermal manner resulted from covalent bonds breakage, are proposed and compared with experimental results. The variation trends of the thermal model predicted groove depths are similar and consistent with the measured ones within selected ranges, while the athermal model leads to groove depth far from reality, demonstrating that the vaporization-caused mechanism is the proper one. Employing the verified model, simulation study is conducted to explore the evolution of temperature field under different fluences. Under a low fluence of 0.071 J/cm2, the peak electron temperature shows a decreasing trend with pulse width, and the temperatures of electron and lattice evolve in a similar pattern when the pulse duration is wider than 200 ps. For a higher fluence of 7.074 J/cm2, lattice temperature increases up to melting and boiling point within 1 ps and 3 ps, respectively, and the groove depth produced by a 12 ps pulse heating is about 0.65 μm. Afterwards, residual heat diffusion during pulse interval and further material removal during following pulse heating will occur, leading to a deeper groove. Moreover, the effects of laser power and critical free electron density on the machining process are also analysed, demonstrating that an increase in any of these two parameters results in a faster element removal.

Thermal Stress Damage Mechanism in Single-Crystal Germanium Caused by 1080 Nm Laser Irradiation

Numerical Analysis of Ultrashort Pulse Laser-Induced Thermomechanical Response of Germanium Thin Films

Numerical Simulations of Germanium Nanofilm under Femtosecond Pulse Laser Heating

Numerical and Experimental Study of Thermal Shock Effect on Germanium Lens Induced by Out-of-band Pulsed-laser

Study of Damage in Germanium Optical Window Irradiated by a Near-infrared Continuous Wave Laser

Investigation on Damage Process of Gaas Induced by 1064 Nm Continuous Laser

Theoretical and Experimental Study of Laser Induced Damage on Gaas by Nanosecond Pulsed Irradiation

Thermal Damage of Monocrystalline Silicon Irradiated by Long Pulse Laser

Femtosecond Laser Processing of Germanium: An Ab Initio Molecular Dynamics Study

Combined Continuum-Atomistic Modeling of Ultrashort-Pulsed Laser Irradiation of Silicon

Photosensitive defects in germanium doped silica glass

Sample Thickness Effect Of Thermal Vibration Correction Within X-Ray Dynamical Theory For Germanium-Doped Silicon

Optical and microstructural studies of femtosecond laser treated amorphous germanium thin coatings

A numerical study of picosecond laser micro-grooving of single crystalline germanium: Mechanism discussion and process simulation

Thermal Stress Effects of the Diode-End-pumped Nd:YLF Slab

Thermodynamic damage behavior of single-crystal MgF2 irradiated by high-power fiber laser

Damage characteristics of 193 nm laser irradiated on MgF2 window

Thermal and Mechanical Breakage Induced by High Power Laser on Optical and Photoelectric Elements

Numerical simulation and validation of subsurface modification and crack formation induced by nanosecond-pulsed laser processing in monocrystalline silicon

Damage mechanism in plasma evolution of nanosecond laser-induced damage of germanium sheets in air and vacuum