Abstract:With the development of power modules for high voltage, high temperature, and high power density, their size is becoming smaller, and the packaging insulation experiences higher electrical, thermal, and mechanical stress. Packaging insulation needs to meet the requirement that internal electric field, temperature, and mechanical stress should be as low as possible. Focusing on the coupling principles and optimization design among electrical, thermal, and mechanical stresses in the power module packaging insulation, a multi-objective optimization design method based on Spice circuit, finite element field numerical calculation, and multi-objective gray wolf optimizer (MOGWO) is proposed. The packaging insulation optimal design of a 1.2 kV SiC MOSFET half-bridge power module is presented. First, the high field conductivity characteristics of the substrate ceramic and encapsulation silicone of the packaging insulation material were tested at different temperatures and external field strengths, which provided the key insulation parameters for the calculation of electric field distribution. Secondly, according to the mutual coupling principles among electric–thermal–mechanical stress, the influence of packaging structure parameters on the electric field, temperature, and mechanical stress distribution of packaging insulation was studied by finite element calculation and combined with Spice circuit analysis. Finally, the MOGWO algorithm was used to optimize the electric field, temperature, and mechanical stress in the packaging insulation. The optimal structural parameters of the power module were used to fabricate the corresponding SiC MOSFET module. The fabricated module is compared with a commercial module by the double-pulse experiment and partial discharge experiment to verify the feasibility of the proposed design method.

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization with Backpropagation Neural Network

Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

Multi-Objective Optimization of a 1200-V Fan-Out Panel-Level SiC MOSFET Packaging with Improved Genetic and Particle Swarm Algorithms

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

Design and evaluation of press-pack SiC MOSFET

A Solution to Press-Pack Packaging of SiC MOSFETS

Reliability-Based and Cost-Oriented Product Optimization Integrating Fuzzy Reasoning Petri Nets, Interval Expert Evaluation and Cultural-Based DMOPSO Using Crowding Distance Sorting

Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Optimization of MOSFET Copper Clip to Enhance Thermal Management Using Kriging Surrogate Model and Genetic Algorithm

Analysis of Novel Packaging Techniques for High Power Electronics in SiC

Optimization Design of Packaging Insulation for Half-Bridge SiC MOSFET Power Module Based on Multi-Physics Simulation

Overview of Finite-Element Analysis in Simulation of SiC Power Device Packaging

A Decoupled Junction Temperature and Aging Level Evaluating Method for SiC MOSFETs

Parameters study of thermomechanical reliability of board-level fan-out package

A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances

A Novel Double-sided Cooling 3L-ANPC SiC MOSFET Power Module with Interleaved Layout

Machine-Learning Assisted Optimization Strategies for Phase Change Materials Embedded within Electronic Packages

Compact Spatially Symmetric Double-Sided Embedded Packaging Method for Parallel SiC MOSFETs

A Junction Temperature and Package Aging Decoupling Evaluating Method for SiC MOSFETs Based on the Turn-on Drain-Source Current Overshoot