Characterization and Compact Modeling of Short Channel MOSFETs at Cryogenic Temperatures

Jixiang Huang,Yuanke Zhang,Yuefeng Chen,Jun Xu,Chao Luo,Guoping Guo
DOI: https://doi.org/10.1016/j.sse.2023.108637
IF: 1.916
2023-01-01
Solid-State Electronics
Abstract:This paper presents an overall characterization, physics-based device analysis, and compact modeling of a commercial 110 nm bulk CMOS technology. I -V measurements and DC parameters extraction are performed on low threshold voltage (low VTH, LVT) and regular VTH (RVT) devices with various geometry dimensions from 300 K to 6 K. Different levels of improvement of subthreshold swing (SS), OFF-state current (IOFF), and mobility indicates the potential to optimize the performance of circuits at cryogenic temperatures. However, the temperature characteristics of the mobility and series resistance show a great dependence on the channel length of the devices, which complicates the calculation of the ON-state current at cryogenic temperatures. Moreover, VTH roll-off caused by short channel effect (SCE) get worse, which can be attributed to the increased bulk Fermi potential (rpf). These channel-length-related effects add extra challenges to the design of cryogenic circuits. An optimized compact model based on BSIM4 is proposed to capture the device characteristics at 6 K, which can produce accurate simulation results only through parameter configuration rather than model equation modification and has been applied to the design of cryogenic CMOS circuits.
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