A Novel Creep-Fatigue Life Evaluation Method for Ceramic-Composites Components

Changqi Liu,Duoqi Shi,Bo Zhang,Xiaoguang Yang,Haofeng Chen
DOI: https://doi.org/10.1016/j.ijmecsci.2023.108259
IF: 7.3
2023-01-01
International Journal of Mechanical Sciences
Abstract:A novel progressive creep-fatigue damage analysis method based on multiscale information was proposed to accurately predict the service life of SiC/SiC composites and their structural components under complex mechanical loads and external environments. First, the strength degradation of SiC fibers involving five damage mechanisms and degradation of the properties of the interface under high-temperature fatigue loading were described quantitatively based on experimental results. Subsequently, a micromechanical model incorporating the global load sharing model, two-parameter Weibull model, shear-lag model, property degradation models of various constituents, and the effect of the braiding angle was utilized to calculate the volume fraction of broken fibers. The fatigue life of 3D 4-directional SiC/SiC composites was predicted and exhibited a trend similar to that of the experimental data. The rupture life of the SiC/SiC composites was calculated considering the stress transfer among microscopic constituents and the influence of creep slow crack growth on the fiber strength. The volume fraction of broken fibers obtained in these micromechanical models was used to perform a gradual strength degradation in the novel progressive creep-fatigue damage analysis method. Microscopic constituents damage and macroscopic property degradation were quantitatively linked in this step. This infuses the micro information into the traditional phenomenological progressive damage method. The gradual stiffness degradation rules were derived from the fitting of the residual elastic modulus obtained from the fatigue and creep experiments. Finally, the damage evolution and service life of SiC/SiC turbine blades were simulated and evaluated as a preliminary validation of the entire process.
What problem does this paper attempt to address?