Abstract:This paper presents a novel algorithm for EMC simulation of electronic package integration. This algorithm is based on hybridizing method of moments with analytical method, modal expansion technique. The entire electronic package domain is divided into two networks: the signal distribution network and the power distribution network. The signal distribution network is simulated using the method of moments, where the equivalent RLCG (resistance, inductance, capacitance and conductance) parameters of the signal traces in the signal layers are extracted. The power distribution network is simulated by using the modal expansion technique, where the equivalent circuit of the power distribution network is obtained. It is straightforward to substitute all the extracted equivalent circuit parameters into a SPICE-like simulator to simultaneously perform the signal and power integrities analyses. With the proposed method, the system-level EMC modeling of the package can be performed efficiently. Numerical examples demonstrate that this approach is able to provide fast yet accurate simulation for signal and power integrities analysis of multilayered electronic packages. In order to further enhance the simulation efficiency, the parallel process of the proposed method is implemented in our institutepsilas high performance computer.

Electromagnetic Analysis in PINMAP Assignment Optimization Based on T-matrix Method.

Efficient EMI Analysis and Self-Shielding Design Method for Pin Map of System-in-Package

In-package P/G Planes Analysis and Optimization Based on Transmission Matrix Method

Investigation on Electromagnetic Responses of Double Objects Illuminated by A High-Power Emp Using Hybrid Tdie-Tdpo Method

Hybrid TDIE-TDPO method using weighted Laguerre polynomials for solving transient electromagnetic problems

Investigation On Electromagnetic Responses Of Some Complex Wire-Surface Composite Objects Using Hybrid Tdie-Tdpo Based Mot Method

Deep Reinforcement Learning-Based Pin Map Optimization of BGA Package for EMC

A Novel Deep Reinforcement Learning Methodology for EMI Mitigation in Multi-Scenario Pinmap Design

Advanced Parallel Algorithm for System-Level EMC Modeling of High-Speed Electronic Package

AIM analysis of electromagnetic transmission through dielectric radomes

A Systematic Coupled Approach For Electromagnetic Susceptibility Analysis Of A Shielded Device With Multilayer Circuitry

Electromagnetic Noise Coupling Analysis of TSV Array by Using Cylindrical Mode Expansion Method

An Efficient Hybrid Technique for Analysis of the Electromagnetic Field Distribution Inside A Closed Environment

Prediction Of Pcb Radiated Emission In Shielding Cavity Using Equivalent Dipole Modeling

Electromagnetic Susceptibility Analysis In Device Level With Numerical Technique Based On Electric Field Integral Equation

An Efficient Method for Power Integrity and Emi Analysis of Advanced Packages

Analysis of Leakage Field from Bounded Wave Electromagnetic Pulse Simulator

A Novel Integrated Approach for Simulation of Electromagnetic Susceptibility Problem

Prediction of Electromagnetic Leakage from Circuits Inside Package

An efficient hybrid hot-spotting and optimization method for radiated emission compliance check

Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid method