Microstructure Evolution and Mechanical Properties of CuW/Al Interface Fabricated by Infiltration and Vacuum Hot-Pressing Diffusion Bonding

Chan Wang,Jian Chen,Shuhua Liang,Wenting Shao,Xigang Yang
DOI: https://doi.org/10.1016/j.vacuum.2023.111882
IF: 4
2023-01-01
Vacuum
Abstract:In the present work, a multiple processing technique that combines infiltration and vacuum hot-pressing diffusion bonding was designed to fabricate the CuW/Al composite. The interfacial microstructure and me-chanical properties was studied. Due to the reaction diffusion, three transition zones formed from CuW side to Al side, which were Al-Cu IMCs layer, (Al2Cu + Al) eutectic and Al-W IMCs zone. Accordingly, five kinds of IMCs formed at the zones, which were identified as Al4Cu9, AlCu, Al2Cu, Al4W and Al12W. The mechanical properties of the CuW/Al interface were improved by the hot-pressing. The maximum shear strength of the interface was 59.8 +/- 1.8 MPa, bonded at 20 GPa, 730 degrees C, 40 min, which was 16% higher than that of the initial CuW/Al composite. This was due to the reduced stress concentration at the interface caused by the thinner interface thickness. With the increasing of bonding temperature and time, the shear strength of CuW/Al was enhanced. The fracture was mainly occurred in the zone I with characteristic of brittle fracture.
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