A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers.

Xiangyu Meng,Yecong LI,Zhiyi Yu
DOI: https://doi.org/10.1587/transele.2022ecp5011
2023-01-01
IEICE Transactions on Electronics
Abstract:This paper proposes a design of high-speed interconnec-tion between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflec-tion coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication band-width requirements of 100-Gbps or even higher data-rate PAM4 signals.
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