A Via/Contact Layout Decomposition Method for Directed Self-Assembly Based on Local Optimization

Hengyu Zhou,Tao Zhang,Sikun Li,Ming Tang,Shisheng Xiong,Xiangzhao Wang
DOI: https://doi.org/10.1109/iwaps57146.2022.9972306
2022-01-01
Abstract:Directed self-assembly (DSA) is an attractive next-generation lithography (NGL) technique. Nevertheless, a high-quality via/contact layout decomposition method is required to enable the technology. In this paper, we introduce a via/contact layout decomposition method based on local optimization. Besides Maximal Cardinality Matching(MCM), this method uses local optimization to reduce the conflicts between grouping and coloring and adds the step of a uniform coloring algorithm to make the density of coloring results uniform. Simulation results show that this method is suitable for large-scale layouts, and achieves better results.
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