Abstract:Conductive copper nanoinks can be used as a low-cost replacement for silver and gold nanoinks that are used in inkjet printing of conductive patterns. We describe a high-throughput, simple, and convenient method for the preparation of copper nanoparticles in aqueous solution at room temperature. Copper acetate is used as the precursor, hydrazine as the reducing agent, and short chain carboxylic acids as capping agents. The concentration of the carboxylic acid plays a key role in the preparation of such copper nanoparticles. Stable copper nanoparticles with a diameter of less than 10 nm and a narrow size distribution were prepared when high concentrations of lactic acid, citric acid, or alanine were used. Thermogravimetric analysis results showed that any lactic acid or glycolic acid adsorbed on the surface of the copper nanoparticles can be removed at a relatively low temperature, especially, glycolic acid, which can be removed from the surface at about 125 °C. Highly conductive copper films prepared using lactic acid and glycolic acid as capping agents were obtained by drop coating a copper nanoparticle paste onto a glass slide followed by low temperature sintering. The electrical resistivity of the copper film using glycolic acid as the capping agent was 25.5 ± 8.0 and 34.8 ± 9.0 μΩ·cm after annealing at 150 and 200 °C for 60 min under nitrogen, respectively. When lactic acid was used as the capping agent, the electrical resistivity of the copper films was 21.0 ± 7.0 and 9.1 ± 2.0 μΩ·cm after annealing at 150 and 200 °C for 60 min under nitrogen, respectively, with the latter being about five times greater than the resistivity of bulk copper (1.7 μΩ·cm).

Low-temperature Calcination of Convenient Micro-Sized Copper Ink with Surface Activation and Synchronous Protection by In-Situ Chemisorbed Cupric Formate

Mixed Ink of Copper Nanoparticles and Copper Formate Complex with Low Sintering Temperatures

Rapid Low Temperature Sintering in Air of Copper Submicron Particles with Synergistic Surface-Activation and Anti-Oxidative Protection

The Synthesis of Copper Nanoparticles for Printed Electronic Materials Using Liquid Phase Reduction Method

Control of chemical kinetics for sub-10 nm Cu nanoparticles to fabricate highly conductive ink below 150 °C

Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature.

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A Novel Method of Synthesizing Antioxidative Copper Nanoparticles for High Performance Conductive Ink

Enhanced Anti-Oxidation Copper-Based Conductive Inks for Low Porosity Copper Films in Power Electronics

Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics

Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

Decomposition mechanism and morphological evolution of in-situ realized Cu nanoparticles in Cu complex inks

Antioxidative Effect of Lactic Acid-Stabilized Copper Nanoparticles Prepared in Aqueous Solution

Fabrication of Oxidation-Resistant Submicron Copper Particles and the Conductive Ink As Well As Its Sintering Behavior on the Flexible Substrate

Preparation and Investigation on Copper Nanoparticles in Conductive Ink

The Low Temperature Exothermic Sintering of Formic Acid Treated Cu Nanoparticles for Conductive Ink

A simple way of preparing high-concentration and high-purity nano copper colloid for conductive ink in inkjet printing technology

Nano-sized Amorphous Carbon Covered Surface Formed by Selective Laser Melting of Ink-Printed (SLM-IP) Copper (cu) Nanoparticles (Nps)

A low-cure-temperature copper nano ink for highly conductive printed electrodes

Synthesis of Stable Ultra-Small Cu Nanoparticles for Direct Writing Flexible Electronics

Copper Nanoparticle Ink Stabilized by Poly(vinylpyrrolidone)-Sodiumdodecylsulphate