Abstract:With the dramatic requirements of high power and high integrity in field of power devices, the study of novel interconnection materials and packaging methods has been paid an extremely attention. Presently, the most candidates for the chip bonding are Zn-based, Bi-based, noble-metal-based (such as Au-Sn, Au-Ge, Au-Si), nano-metal particles (Ag or Cu nanoparticles) and transient-liquid-phase (TLP) bonding. However, a high bonding temperature and poor ductility for Zn-based solder (more than 420°C) causing irreversible damages or accelerated aging affects to the electronic devices; Bi-based solder alloys are still under way mainly due to their inferior thermal and electrical conductivity as well as poor workability; It's worth noting that nano-silver sintering and TLP bonding technology have been proven to be the potential solutions to the power electronic packaging, because their processing temperatures are relatively low and the produced joints are of high re-melting temperatures. However, Ag is expensive and easy to electromigration, which will influence the stability/reliability of the joints and hinder to universal industry applications. For the TLP bonding, the process to produce full intermetallic compounds (IMCs) is time-consuming, commonly more than 60 min, due to relatively low reaction velocity. To solve the problem of time-consuming of the TLP, an enhanced and low-cost auxiliary energy is necessary. Ultrasonic-assisted soldering has been proven able to solder dissimilar metals at low temperatures within a very short time. In our previous work, a full Cu6Sn5/Cu3Sn IMCs joint through TLP assisted by ultrasound was obtained. Because of the acoustic cavitation and streaming effect created by ultrasonic waves propagating in molten alloys, the atom diffusion and physical-chemical interactions were accelerated at the liquid/solid interfaces. However, a sole IMC joint with single phase has not been fabricated so far. High re-melting temperature joint consisted of nearly sole Ni 3 Sn 4 with a high shear strength of 43.4 MPa was achieved with Sn-24 wt.%Ni by ultrasonic-assisted soldering for 10 s. This rapidly formed intermetallic joint was phase-stable as isothermally aged at 300 °C for 72 h in air and its shear strength was 33.4 MPa due to the Ni 3 Sn 4 grains coarsening. These results demonstrate that the less time-consuming ultrasonic-assisted soldering has wide potentials for high-temperature power electronic packaging.

High-Reliability Bonding by Nano-Silver Paste with Tin Addition for High Temperature Electronic

Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding

Ag-Sn Bimetallic Nanoparticles Paste for High Temperature Service in Power Devices

Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

Low-Temperature sintering bonding using silver nanoparticle paste for electronics packaging

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Die-attach Bonding at 230 °C Using Micron Sn-coated Zn Particles for High-Temperature Applications

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging

Rapid Formation of Intermetallic Joints with Sn/metal Composite Alloys by Ultrasonic-Assisted Soldering for High-Temperature Chip Attachment

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging.

Tin Nanoparticles Modified Nano-Silver Paste for Pressureless Low-Temperature Sintering Process

Thermal Reliability Investigation of Ag-Sn TLP Bonds for High-Temperature Power Electronics Application

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Ag-Sn Fluxless Wafer Bonding Technology

Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection

Microstructure of Ag Nano Paste Joint and Its Influence on Reliability

Microstructure Characterization and Mechanical Behavior for Ag3sn Joint Produced by Foil-Based Tlp Bonding in Air Atmosphere

Cu-Cu joining using citrate coated ultra-small nano-silver pastes