Abstract:Silver nanoparticles (Ag-NPs) with the average size of 9 nm and tin nanoparticles (Sn-NPs) with the average size of 30 nm were synthesized via chemical reduction in aqueous solutions, respectively. Then, a novel nano-sliver paste modified by tin nanoparticles (NSP-TNP) was developed and the influences of Sn-NPs content, sintering time and temperature on bonding strength of NSP-TNP joints were studied. After sintering the nano-silver paste modified by 3 wt.% Sn-NPs at 206 °C for 30 min without externally applied pressure, the bonding strength of sintered NSP-TNP joints reaches 34 MPa. The enhanced mechanical strength of the sintered NSP-TNP joints is owing to the denser structure and solid-solution strengthening when Sn-NPs were added to the nano-silver paste. The NSP-TNP is promising to be used in power semiconductor (e.g., SiC) packaging due to some advantages such as higher bonding strength, lower processing temperature and reduced cost.

Tin Nanoparticles Modified Nano-Silver Paste for Pressureless Low-Temperature Sintering Process