Abstract:The eddy-current method has been employed to realize the real-time measurement of thickness distribution and polishing endpoint detection of metal films during the metal chemical mechanical polishing (CMP) process. However, accuracy and sensitivity in thickness measurement can be significantly impacted by a variation in lift-off distance (about 3.5 mm), attributable to the progressive wear of the polishing pad. This paper proposes a novel triple-coil sensor system, integrated with an alternating-current bridge and designed for high-precision metal film thickness measurement. Subsequently, the measurement performance of the bridge output voltage was scrutinized using a theoretical model and a trans-dimensional finite element analysis model of electromagnetic fields and circuit coupling. The correlations between the amplitude, phase, and the ratio of the real part to the imaginary part of the output voltage, in context with film thickness, were determined at assorted excitation frequencies and lift-off distances. Both theoretical equations and simulation results affirmed that the phase and ratio were more resistant to lift-off distance variations than the amplitude, and a linear relationship was identified between the ratio and film thickness. Furthermore, the thickness measurement performance of the amplitude and phase, when the triple-coil was imbalanced, was dissected via numerical simulation. A profound understanding of the proposed system was provided and beneficial for the practical applications in real-time thickness measurements of metal films during the metal CMP process.

Improvement of Sensitivity of Eddy Current Thickness Sensors with Ferrite Core for CMP Process

Thickness Measurement Based on Eddy Current Sensor with Coaxial Double Coil for Chemical Mechanical Polishing

Computational Investigation of a Novel Metal Thickness Measurement System with Coaxial Triple-Coil Sensor for Chemical Mechanical Polishing

Metal Thickness Measurement System Based on a Double-Coil Eddy-Current Method with Characteristic Ratio Detection.

Edge Effects of an Eddy-Current Thickness Sensor During Chemical Mechanical Polishing

Cu Layer Thickness Monitoring in CMP Process by Using Eddy Current Sensor

Eddy current testing in thickness measurement of material with multi-layer structure

In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone

Improvement of sensitivity of eddy current sensors for nano-scale thickness measurement of Cu films

On-line thickness monitoring technique based on eddy-current and virtual system

Noncontact Thickness Measurement of Metal Films Using Eddy-Current Sensors Immune to Distance Variation

Thickness Measurement of Metallic Film Based on a High-Frequency Feature of Triple-Coil Electromagnetic Eddy Current Sensor

Unconventional coil shape design of eddy current sensors and the effect of shape parameters on the micro/nano-scale metal film thickness measurement performance

Signal Processing and Analysis for Copper Layer Thickness Measurement Within a Large Variation Range in the CMP Process.

In-situ Measurement Methods of the Metal Layer Thickness on Wafer with Nanometer Precision

Eddy Current Measurement of the Thickness of Top Cu Film of the Multilayer Interconnects in the Integrated Circuit (IC) Manufacturing Process

Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer on Wafer for CMP Application

Analytical Model for Eddy Current Testing of Thickness of Multi-layered Structures and Experimental Verification

Global Thickness Measurement System for Metal Layer on Wafer

Thickness Measurement of Nano-Metallic Film with Electromagnetic Sensor under Large Sensor-Sample Distance

In-situ Cu Layer Thickness Measurement During Chemical Mechanical Planarization