Ka-band Broadband Filtering Packaging Antenna Based on Through-Glass Vias (Tgvs)
Zhen Fang,Jihua Zhang,Libin Gao,Hongwei Chen,Wenlei Li,Tianpeng Liang,Xudong Cai,Xingzhou Cai,Weicong Jia,Huan Guo,Yong Li
DOI: https://doi.org/10.1631/fitee.2200573
IF: 2.526
2023-01-01
Frontiers of Information Technology & Electronic Engineering
Abstract:This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass via (TGV) technologies. Compared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging devices) and have superior microwave performance. Glass substrate can realize 3D high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The BPF unit has three pairs of λg/4 slots (defect microstrip structure, DMS) and two λg/2 U-shaped slots (defect ground structure, DGS). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33-GHz broadband filtering antenna is optimized, debugged, and measured. The antenna could achieve |S11|<−10 dB in 29.4–36.4 GHz, and yield an impedance matching bandwidth up to 21.2