A Low-Loss Bandpass Filter with Stacked Double-Layer Structure using Glass-based Integrated Passive Device Technology

Haozhe Ma,Zhihui Hu,Daquan Yu
DOI: https://doi.org/10.1109/led.2023.3275197
IF: 4.8157
2023-01-01
IEEE Electron Device Letters
Abstract:In this letter, a third-order low Insertion loss bandpass filter (BPF) is proposed by using a stacked double-layer structure through the technologies of the glass-based integrated passive device (IPD) and the through glass vias (TGVs). First, a stacked multi-layer structure was introduced to create a 3D-inductor of large inductance with a high Q factor. Then, an air cavity Metal-Insulator-Metal (MIM) structure was used to upgrade the Q factor of the capacitor. Therefore, a third-order low-loss small-sized bandpass filter can be generated by utilizing these LC elements of high Q factors. Experimental results show that the proposed BPF’s size and insertion loss is 0.018λ0 × 0.013λ0 and 0.81 dB, respectively. In comparison with the existing design, the proposed BPF shows the superior advantages of smaller size and lower insertion loss.
engineering, electrical & electronic
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