Compact Multilayer Bandpass Filter Using Low-Temperature Additively Manufacturing Solution

Mengze Li,Yang Yang,Francesca Iacopi,Minoru Yamada,Jaim Nulman
DOI: https://doi.org/10.1109/ted.2021.3072926
IF: 3.1
2021-07-01
IEEE Transactions on Electron Devices
Abstract:This article presented an additively manufactured bandpass filter (BPF) based on a second-order stub-loaded resonator consisting of multimetal layer components. The proposed BPF is fabricated by a low-temperature (140°) additively manufactured electronics (AME) solution that can fabricate conductive and dielectric materials simultaneously with multimetal-layer and flexible interlayer distance. By reducing the interlayer distance, constant inductance and capacitance can be realized in smaller sizes, which helps to achieve device minimization. Taking advantage of this inkjet printing technology, a second-order multimetal layer resonator is proposed. To understand the principle of the BPF, an equivalent circuit with odd- and even-mode analysis is demonstrated. For verification, the frequency response of the circuit's mathematical model is calculated to compare with the electromagnetic simulation results. Good agreement can be achieved among the calculated, simulated, and measured results. The proposed BPF is designed at 12.25 GHz with a bandwidth of 40.8% and a compact size of 2.7 mm $times1.425$ mm $times0.585$ mm or $0.186lambda {g} times 0.098lambda {g}times 0.040lambda {g}$ , which is suitable for circuit-in-package applications in television programs, radar detection, and satellite communications.
engineering, electrical & electronic,physics, applied
What problem does this paper attempt to address?
The main problem that this paper attempts to solve is to design a compact multi - layer band - pass filter (BPF) by using the low - temperature additive manufacturing technology (AME). Specifically, the paper aims to achieve this goal through the following aspects: 1. **Device miniaturization**: Utilize the low - temperature additive manufacturing technology to achieve accurate printing of multi - metal - layer components, thereby reducing the size of the filter. It is mentioned in the paper that by reducing the inter - layer distance, a constant inductance and capacitance can be achieved in a smaller space, which is helpful for device miniaturization. 2. **Performance improvement**: A multi - metal - layer band - pass filter based on the second - order short - circuit - loaded resonator is designed. By optimizing design parameters such as the inter - layer distance, inductance and capacitance values, the performance of the filter is improved, including bandwidth, insertion loss and suppression characteristics. 3. **Verification method**: In order to verify the effectiveness of the design, the paper uses the equivalent circuit model and the odd - even mode analysis method. By calculating the frequency response of the circuit model and comparing it with the electromagnetic simulation results, the feasibility of the design is verified. 4. **Practical application**: The designed band - pass filter operates at 12.25 GHz, has a bandwidth of 40.8% and a size of only 2.7 mm × 1.425 mm × 0.585 mm, and is suitable for application scenarios such as television programs, radar detection and satellite communication. ### Specific problems and solutions - **Manufacturing of multi - metal - layer components**: Utilize the low - temperature additive manufacturing technology to simultaneously print conductive materials and dielectric materials to achieve seamless integration of multi - metal - layer components. This is more flexible and cost - effective than traditional LTCC and semiconductor technologies. - **Optimization of inductance and capacitance**: By adjusting the inter - layer distance, the values of inductance and capacitance are optimized to achieve higher performance. For example, for a spiral inductor, by reducing the thickness of the dielectric layer, the inductance value can be increased; for a multi - layer capacitor, by reducing the thickness of the dielectric layer, the capacitance value can be significantly increased. - **Equivalent circuit model**: An equivalent lumped - element circuit model is proposed for analyzing the frequency response of the filter. Through odd - even mode analysis, the expression of input admittance is derived, and the positions of transmission poles and transmission zeros are further calculated. - **Experimental verification**: The effectiveness of the design is verified by comparing the simulation and measurement results. The measurement results show that the insertion loss and return loss of the filter are 3.42 dB and 16.65 dB respectively, the bandwidth is 40.8%, and the suppression level in the upper stop - band is more than 20 dB. In conclusion, through the low - temperature additive manufacturing technology, this paper successfully designs and verifies a compact multi - layer band - pass filter, and solves the limitations of traditional manufacturing technologies in device miniaturization and performance improvement.