Dislocation Reconfiguration During Creep Deformation of an Al-Cu-Li Alloy Via Electropulsing

Chang Zhou,Lihua Zhan,He Li,Chunhui Liu,Yongqian Xu,Bolin Ma,Youliang Yang,Minghui Huang
DOI: https://doi.org/10.1016/j.jmst.2022.05.008
2022-01-01
Abstract:Creep mechanism was well-known to be mainly dominated by the dislocation sliding and climbing during creep deformation.Here we study the creep deformation of an Al-Cu-Li alloy with the assistance of elec-tropulsing and subsequent microstructural observations.We find that creep strain increased drastically under electropulsing and was almost twelve times as much as that of the non-pulsed sample.Microstruc-tural observations confirmed that dislocation reconfiguration happens via electropulsing,namely helical dislocations being opened rapidly.This opened dislocation structure can possess a much higher mobility than the initial helical dislocation,which mostly responsible for the greatly increased creep strain.Our results revealed a new mechanism accountable for the distinctly electroplastic creep deformation.
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