STEP Application Protocol Interoperability for CAD/CAPP Integration

Shensheng Zhang,Xiaolin Hou,Zhonghui Wang
DOI: https://doi.org/10.1115/cie1995-0798
1995-01-01
Abstract:Abstract To support the requirement of concurrent engineering (CE), we need current STEP APs interpretable to integrate different applications in different phases of the entire lifetime cycle of a product. COMposition Application Protocols (COMAP) introduced and discussed in this paper is proposed to solve this problem. COMAP, serving as a root AP, is built on top of existing STEP APs for mapping information among them. A prototype of COMAP (cadpp) based on AP203 and AP224 for CAD/CAPP integration is implemented and discussed.
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