COMposition AP for Products’ Lifetime Cycle Integration

Hou Xiaolin,Zhang Shensheng,Wang Zhonghui,侯晓林
1995-01-01
Abstract:A concept called COMposition Application Protocols (COMAP) is introduced and discussed in this paper. COMAP is built on the top of the existing STEP APs as a root AP for mapping information among those different APs. A prototype of COMAP (cadp) based on AP203 and AP224 for CAD/CAPP integration is implemented and discussed.
What problem does this paper attempt to address?