Ultrasonic assisted helical grinding of SiCf/SiC ceramic matrix composites

ZHANG Haitao,BAO Yan,YANG Feng,SUN Haiqi,DONG Zhigang,KANG Renke

DOI: https://doi.org/10.13394/j.cnki.jgszz.2021.0107

2022-01-01

Abstract:SiC fiber reinforced SiC ceramic matrix composites (SiCf/SiC) have problems such as poor machining quality and difficult material removal. To study these problems, SiCf/SiC composites were processed by ultrasonic-assisted helical grinding. The exit quality of hole, hole wall morphology and three-dimensional surface roughness of hole wall were explored. The results show that compared with traditional hole making, the material at the exit of the hole made by ultrasonic-assisted helical grinding has no large area chipping. The periodic change of the angle θ between the direction of the cutting speed of the grinding wheel and the fiber direction leads to regular changes in the surface morphology of the hole wall. When θ is 0°/180°, the fiber and the matrix are debonded. When θ is 45°, the fiber is sheared and fractured. When θ is 90°, the fiber is crushed and fractured. When θ is 135°, the fiber has both shear fracture and extrusion fracture. The hole wall surface roughness Sa is the lowest value when θ is 90°, and Sa is the highest value when θ is 135°. Within a certain range, the surface roughness value Sa decreases with the increase of the ultrasonic amplitude, with a maximum decrease of 38.7%, and increases with the increase of the feed rate, with a maximum increase of 39.3%.