Microstructure and Properties of Al-Si/Al-SiCp Bilayer Composite for Electronic Packaging

Zhou Wei,Wang Richu,Peng Chaoqun,Cai Zhiyong

DOI: https://doi.org/10.1007/s10854-022-07932-4

2022-01-01

Journal of Materials Science Materials in Electronics

Abstract:A bilayer composite consisting of Al-50 wt% Si alloy and Al-70 vol% SiC p for electronic packaging was prepared by hot pressing. The results show that no obvious defects are observed, and strong interlayer bonding is obtained. With the Al–SiC p layer and the Al–Si layer as the load-bearing surface, the bending strength of the bilayer composite reaches 459 MPa and 241 MPa, respectively. The sample with the Al–SiC p layer as the load-bearing surface is subjected to the lowest tensile stress, while the sample with the Al–Si layer as the load-bearing surface is subjected to the highest tensile stress. The thermal conductivity and coefficient of thermal expansion (CTE) of the bilayer samples with different thickness ratios are between the values of the Al–SiC p composite and the Al–Si alloy. As the thickness percentage of the Al–SiC p layer increases, the thermal conductivity of the bilayer composite increases, while the CTE decreases gradually. Simple equations can be used to estimate the thermal conductivity and CTE of the bilayer composite.