Abstract:SID Symposium Digest of Technical PapersVolume 52, Issue S1 p. 145-145 Technical Sessions: Session 23: Quantum Dot Electroluminescence 1 (Emissive Display)Free to Read 23.1: Invited Paper: High efficiency and Stability of Ink-jet Printed Quantum Dot Light Emitting Diodes via Dual Ionic Surface Passivation Chaoyu Xiang, Corresponding Author Chaoyu Xiang xiangchaoyu@nimte.ac.cn TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 China Division of Functional Materials and Nano Devices, Ningbo Institute of Materials Technology and Engineering, CAS, Ningbo, ChinaSearch for more papers by this authorLongjia Wu, Longjia Wu TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorZizhe Lu, Zizhe Lu TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorMenglin Li, Menglin Li Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong SAR, P. R. China; Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong SAR, P. R. ChinaSearch for more papers by this authorYanwei Wen, Yanwei Wen State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074 Hubei, People's Republic of ChinaSearch for more papers by this authorYixing Yang, Yixing Yang TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorWenyong Liu, Wenyong Liu TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorTing Zhang, Ting Zhang TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorWeiran Cao, Weiran Cao TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorSai-Wing Tsang, Sai-Wing Tsang Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong SAR, P. R. China; Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong SAR, P. R. ChinaSearch for more papers by this authorBin Shan, Bin Shan State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074 Hubei, People's Republic of ChinaSearch for more papers by this authorXiaolin Yan, Xiaolin Yan TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorLei Qian, Lei Qian TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 China Division of Functional Materials and Nano Devices, Ningbo Institute of Materials Technology and Engineering, CAS, Ningbo, ChinaSearch for more papers by this author Chaoyu Xiang, Corresponding Author Chaoyu Xiang xiangchaoyu@nimte.ac.cn TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 China Division of Functional Materials and Nano Devices, Ningbo Institute of Materials Technology and Engineering, CAS, Ningbo, ChinaSearch for more papers by this authorLongjia Wu, Longjia Wu TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorZizhe Lu, Zizhe Lu TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorMenglin Li, Menglin Li Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong SAR, P. R. China; Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong SAR, P. R. ChinaSearch for more papers by this authorYanwei Wen, Yanwei Wen State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074 Hubei, People's Republic of ChinaSearch for more papers by this authorYixing Yang, Yixing Yang TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorWenyong Liu, Wenyong Liu TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorTing Zhang, Ting Zhang TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorWeiran Cao, Weiran Cao TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorSai-Wing Tsang, Sai-Wing Tsang Center of Super-Diamond and Advanced Films (COSDAF), City University of Hong Kong, Hong Kong SAR, P. R. China; Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong SAR, P. R. ChinaSearch for more papers by this authorBin Shan, Bin Shan State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074 Hubei, People's Republic of ChinaSearch for more papers by this authorXiaolin Yan, Xiaolin Yan TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 ChinaSearch for more papers by this authorLei Qian, Lei Qian TCL Corporate Research, No. 1001 Zhongshan Park Road, Nanshan District, Shenzhen, 518067 China Division of Functional Materials and Nano Devices, Ningbo Institute of Materials Technology and Engineering, CAS, Ningbo, ChinaSearch for more papers by this author First published: 24 February 2021 https://doi.org/10.1002/sdtp.14410AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat No abstract is available for this article. Volume52, IssueS1International Conference on Display Technology (ICDT 2020)February 2021Pages 145-145 RelatedInformation

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