Investigation on hot deformation behavior of 2050 Al-Cu-Li alloy

MA Xiaoguang,YANG Yuyan,LUO Rui,XU Yanjin,CAO Yun,ZENG Yuansong
DOI: https://doi.org/10.11868/j.issn.1005-5053.2021.000014
2021-01-01
Abstract:In this paper, Gleeble-3500 thermal simulator was employed to perform single-pass isothermal compression tests of a spray formed 2050 Al-Cu-Li alloy at a temperature range of 350 to 470 ℃ and a strain rate range of 0.01 to 5 s−1. The flow stress curves of the alloy were captured and the flow data were made into 3D hot processing map subsequently as a guidance for industrial production. At the same time, EBSD technique was applied to characterize the evolution of hot deformation microstructure of the alloy. The results show that the flow stress of the alloy increases with the decreasing deformation temperature and rising strain rate. 3D hot processing map shows that the dissipation power of the alloy has two peaks, and the optimal hot working interval is from to 450-470 ℃, 0.01 - 0.1 s−1. The microstructure analysis of EBSD shows that the original grains of the alloy are significantly elongated after hot deformation, and a large number of recrystallized grains are found in the intergrain and grain boundary of the alloy at 470 ℃/0.01 s−1, which indicates that the alloy has good hot working performance under such deformation conditions.
What problem does this paper attempt to address?