Field-Plated NiO/Ga2O3 P-N Heterojunction Power Diodes with High-Temperature Thermal Stability and Near Unity Ideality Factors

Hehe Gong,Zhengpeng Wang,Xinxin Yu,Fangfang Ren,Yi Yang,Yuanjie Lv,Zhihong Feng,Shulin Gu,Rong Zhang,Youdou Zheng,Jiandong Ye
DOI: https://doi.org/10.1109/jeds.2021.3130305
2021-01-01
IEEE Journal of the Electron Devices Society
Abstract:In this work, vertical NiO/Ga 2 O 3 heterojunction diodes (HJDs) integrated with SiN x /Al 2 O 3 double-layered insulating field plate (FP) structures have been demonstrated. With the additional post-annealing, the resultant diode exhibits a decreased differential specific on-resistance ( $\text{R}_{\mathrm{ on,sp}}$ ) of 5.4 $\text{m}\boldsymbol{\Omega } \cdot $ cm 2 and an enhanced breakdown voltage (BV) of 1036 V. The improved performance is attributed by the combination of the FP-suppressed crowding electric field at the device edge and the reduced trap density at the NiO/Ga 2 O 3 interface. In particular, the near-unity ideality factor has been achieved for this p-n HJD at an elevated temperature of 275 °C, indicating that the diffusion current is dominated. The high-temperature operation capability is owing to the quality improvement of NiO/Ga 2 O 3 interface, where the Shockley-Read-Hall (SRH) recombination mediated by deep-level defects within the depletion region is thus suppressed.
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