Properties of inorganic high-temperature adhesive for high-temperature furnace connection

Yang Chen,Xing Wang,Chao Yu,Jun Ding,Chengji Deng,Hongxi Zhu
DOI: https://doi.org/10.1016/j.ceramint.2019.01.190
IF: 5.532
2019-05-01
Ceramics International
Abstract:A novel type of inorganic high-temperature adhesive that can be cured at room temperature and applied to a high-temperature furnace was prepared using alumina and micro-silica as materials, liquid aluminum dihydrogen phosphate as a binder, and then sintered at a high temperature. To evaluate the mass ratio of Al2O3:SiO2 and the optimal sintering system, the physical properties of the adhesive after sintering were tested, and the phase and microstructure were characterized. The results revealed that the physical properties of the adhesive at 1300–1600 °C were better at a mass ratio of Al2O3:SiO2 = 5:1. When the sintering temperature was 1300 °C, columnar mullite was formed. At 1500 °C, the adhesive had a high shear strength.
materials science, ceramics
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