Rigid Restraint Thermal Self-Compressing Bonding of Ti6AI4V Alloy by Local Induction Heating

Pan Rui,Deng Yunhua,Zhang Hua
2021-01-01
Rare Metal Materials and Engineering
Abstract:Rigid restraint thermal self-compressing bonding (TSCB) by local induction heating is a new diffusion bonding technique proposed in this research. Experiments were conducted on Ti6A14V plates to prove the feasibility of rigid restraint thermal self-compressing bonding by local induction heating. Moreover, finite element analysis was employed to numerically investigate the thermal elastic-plastic stress-strain cycle during thermal self-compressing bonding by local induction heating. Results show that the solid-state joint has homogeneous microstructure and excellent mechanical properties. By local induction heating, an internal elasto-plastic stress-strain field is developed which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints.
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