Abstract:The combined effects of thermomigration (TM) and electromigration (EM) were investigated in Cu/Sn3.0Ag0.5Cu/Ni solder joints by applying a 5×103A/cm2 DC current to the joints. With a thermal gradient, the Cu atoms and Ni atoms were found to migrate towards the lower temperature side while the Sn atoms were found to migrate towards the higher temperature side. For the solder joint stressed with a 5×103A/cm2 DC current, TM was found to play a dominant effect on the migration of Cu atoms in the solder because the Cu atomic flux in the solder which was induced by EM was smaller than that was induced by TM. The Ni atomic flux in the solder that was induced by TM was smaller than that induced by EM, but it could not be ignored because the values were the same order of magnitude. The Sn atomic flux induced by TM could be ignored due to its smaller magnitude than that induced by EM. The Cu3Sn IMC layer and Cu6Sn5 IMC layer at the Cu/solder interface in the joint with Cu as the anode were thicker than corresponding layers at the Cu/solder interface in the joint with Cu as the cathode. The IMC at the Ni/solder interface of joint with Cu as the anode was the Ni3Sn4 phase while that in the solder joint with Cu as the anode was the (Cu,Ni)6Sn5, and the former was thicker than the latter. EM and TM induced dissolution of the Ni3Sn4 IMC into the solder was found to be the main cause of the formation of voids at the Ni3Sn4/solder interface from a joint that used Cu as the anode. For the solder joint that used Cu as the anode, the Ni3Sn4 IMC layer at the Ni/solder interface was as thick as the Cu-Sn IMC layer at the Cu/solder interface. By contrast, for the solder joint that used Cu as the cathode, the IMC layer at the Ni/solder interface was thinner than that at the Cu/solder interf- - ace.

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Quantitative X-Ray Microtomography Study of 3-D Void Growth Induced by Electromigration in Eutectic Snpb Flip-Chip Solder Joints

A Molecular Dynamics Investigation of the Micro-Mechanism for Vacancy Formation Between Ag3Sn and Βsn under Electromigration

Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects

Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density

Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

Quantitative analysis of atomic migration in lithium-ion conducting oxide solid electrolytes

Electromigration and Thermomigration in Sn3Ag0.5Cu Solder Joints

An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints

In Situ Measurement of Electromigration-Induced Transient Stress in Pb-free Sn–Cu Solder Joints by Synchrotron Radiation Based X-Ray Polychromatic Microdiffraction

Effect of Electromigration of Sn-xAg-Cu Solder Joints on Its Microstructure and Mechanical Properties

In Situ Measurement of Stress Evolution in Sn-based Solder Joint under Electromigration Based on X-ray Diffraction Technique

First-principles Calculations of the Effects of Cu and Ag Additions on the Electromigration of Sn-based Solder

Effect of intermetallic on electromigration and atomic diffusion in Cu/SnAg 3.0Cu 0.5/Cu joints: Experimental and first-principles study

Extreme Anisotropy of Electromigration: Nickel in Single-Crystal Tin

Research on atomic migration of Cu-Pillar bumps in electric and thermal fields

Atomistic Study of Self-Diffusion in Cu–Ag Immiscible Alloy System

In Situ Study On The Effect Of Thermomigration On Intermetallic Compounds Growth In Liquid-Solid Interfacial Reaction

An in situ elemental migration on a nanosize Cu-Sn interface in a microscope